Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Darryl Kostka"'
Publikováno v:
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI).
RF interference can be a significant problem in modern day electronic devices. We present a workflow for the simulation of RF interference using a combination of 3D full-wave simulation and a system-level approach. This methodology helps reveal the t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7fd53c20709555090f232d64a6c116a6
https://doi.org/10.1109/isemc.2017.8077917
https://doi.org/10.1109/isemc.2017.8077917
Autor:
Darryl Kostka, Robert Trieb, Andy Heinig, Alexander Steinhardt, Matthias Troescher, Antonio Ciccomancini Scogna, Andreas Henkel
Publikováno v:
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC).
The goal of this work is to electrically model TSVs and 3D interposer interconnects by means of three dimensional (3D) full wave electromagnetic simulations and a circuit like approach for a very fast simulation. The full wave simulations provide a c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::83333a581c8a813535c1c56037ae92e4
https://doi.org/10.1109/isemc.2016.7571684
https://doi.org/10.1109/isemc.2016.7571684
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 9:52-64
Three-dimensional electromagnetic simulation models are often simplified in order to reduce simulation time and memory requirements without sacrificing the accuracy of the results. A commonly adopted methodology in the simulation of complex electroni
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::275e253c74d7aa2e2528426dd55852bf
https://doi.org/10.4071/imaps.318
https://doi.org/10.4071/imaps.318
Publikováno v:
International Symposium on Microelectronics. 2011:000061-000068
Three-dimensional electromagnetic simulation models are often simplified in order to reduce the simulation time and memory requirements without sacrificing the accuracy of the results. A commonly adopted methodology in the simulation of electronic pa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8a45c362ca514efd64c8ae6d5b6a4ec3
https://doi.org/10.4071/isom-2011-ta2-paper2
https://doi.org/10.4071/isom-2011-ta2-paper2
Publikováno v:
2013 IEEE International Symposium on Electromagnetic Compatibility.
Passive channels pose significant challenges to the serial link transmission for single-ended buses running at very high speed. This paper will cover different aspects of the challenges in modeling chips, packages, PCB's, connectors and their interac
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e3165991bab70f2cccad275a7cfe2da9
https://doi.org/10.1109/isemc.2013.6670480
https://doi.org/10.1109/isemc.2013.6670480
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
3D IC based systems necessitate a chip-package co-design approach since the TSV response in the chip stack can propagate into the package. In this work, we demonstrate a chip-interposer co-analysis methodology that includes the 3D CAD model of the 3D
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2ac37e0bc49276eb1c47848bcac8e7ee
https://doi.org/10.1109/ectc.2013.6575872
https://doi.org/10.1109/ectc.2013.6575872
Publikováno v:
2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.
The electrical performance of vias in multilayer PCBs is investigated. In particular the resonance effect due to overlapping anti-pads is characterized and an analytical formulation based on the dimensions of the cavity formed by the anti-pads and th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::079a04bbf5b1535c7274ea54446e2194
https://doi.org/10.1109/epeps.2012.6457852
https://doi.org/10.1109/epeps.2012.6457852
Publikováno v:
2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems.
The electrical performance of high speed signaling in coupled differential microstrip lines is analyzed. Based on the modal decomposition analysis, the cancellation frequency in the single-ended insertion loss response is explained and a closed formu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ae3479b9c1a3e56336266651ab2b2650
https://doi.org/10.1109/epeps.2011.6100190
https://doi.org/10.1109/epeps.2011.6100190
Autor:
Darryl Kostka, Ramesh Abhari
Publikováno v:
2008 IEEE Antennas and Propagation Society International Symposium.
In this paper, application of artificial magnetic conductor (AMC) surfaces for increasing the inductance of printed inductors is investigated through fullwave simulations. Two AMC structures are designed that have periodic (design A) and non-periodic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::32a8d855f3a37ca62e914038f2a7add1
https://doi.org/10.1109/aps.2008.4619728
https://doi.org/10.1109/aps.2008.4619728
Publikováno v:
2007 IEEE Electrical Performance of Electronic Packaging.
Multiconductor transmission line theory (MTL) is employed in modeling of multilayer power distribution networks. This approach is utilized to predict the impedance profile of a mesh-based PDN at various port locations and results are verified by IBM'
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3165393c87c2cb90a05b0c13b50119aa
https://doi.org/10.1109/epep.2007.4387179
https://doi.org/10.1109/epep.2007.4387179