Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Dario Herraiz"'
Publikováno v:
IEEE Access, Vol 12, Pp 61336-61342 (2024)
It is well-known that Empty Substrate Integrated Waveguides allow not only the integration of classic waveguides, such as rectangular waveguides, into a printed circuit board maintaining the quality of traditional waveguide devices, but also keeping
Externí odkaz:
https://doaj.org/article/6922911e731a406b9fe78de7248cc3b7
Autor:
David Herraiz, Hector Esteban, Dario Herraiz, Juan J. De Dios, Marcos D. Fernandez, Angel Belenguer, Vicente E. Boria
Publikováno v:
IEEE Access, Vol 12, Pp 35630-35642 (2024)
High-directivity and low-loss directional couplers based on Empty Substrate Integrated Coaxial Line (ESICL) technology are presented in this article. The proposed coupled line directional couplers are based on the combination of a high-isolation sect
Externí odkaz:
https://doaj.org/article/9a9f2c5425914e8982f40d37c0056fc7
Publikováno v:
IEEE Access, Vol 12, Pp 3617-3628 (2024)
The electrical response of low-frequency band-pass filters based on periodic substrate integrated waveguide (SIW) technology typically shows permitted and forbidden frequency bands. Therefore, this type of filters can be designed using a conceptually
Externí odkaz:
https://doaj.org/article/3dfc9ecb10ca46fe97dc2a8f0125a328
Publikováno v:
IEEE Access, Vol 11, Pp 65599-65607 (2023)
This paper presents a novel dielectricless floating patch antenna structure fed with an empty substrate integrated waveguide (ESIW). The main premise is to eliminate the dielectric from the patch design, which is equivalent to have an air-dielectric
Externí odkaz:
https://doaj.org/article/28fcaca43c5142b7ad7fd72e1afc92e1
Publikováno v:
IEEE Access, Vol 9, Pp 165745-165753 (2021)
The Empty Substrate Integrated Waveguides (ESIW) maintain the advantages of the Substrate Integrated waveguide (SIW) (i.e. low-volume, low profile, lightweight, easy manufacturing, and integration in a planar circuit board), and present lower losses
Externí odkaz:
https://doaj.org/article/61f5d372385444ecab9580807e7d7996
Autor:
Darío Herraiz, Angel Belenguer, Marcos Fernandez, Santiago Cogollos, Héctor Esteban, Vicente E. Boria
Publikováno v:
Applied Sciences, Vol 13, Iss 21, p 11698 (2023)
3D printing is one of the most promising manufacturing methods in the most developed technological fields, including microwave hardware fabrication. On the other hand, the well-known manufacturing methods of planar substrate integrated circuits allow
Externí odkaz:
https://doaj.org/article/4a3b65f164ac45b6ade7aa339f17a6e3
Publikováno v:
Applied Sciences, Vol 12, Iss 24, p 12925 (2022)
This paper presents a feasibility study for designing a floating patch antenna structure fed with a probe from a microstrip. The main premise is to eliminate the dielectric in the patch design, which is equivalent to having an air dielectric and lead
Externí odkaz:
https://doaj.org/article/f3e1a2a0d1214b1cbb5e2891a854a8bd