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pro vyhledávání: '"Daqing Max Shi"'
Autor:
J.W. Carbin, Daqing Max Shi
Publikováno v:
1996 Proceedings 46th Electronic Components and Technology Conference.
This paper focuses on significant advances in flip-chip underfill materials via a thorough characterization of the uncured and cured material properties. These characteristics are then translated into what amounts to substantial gains in productivity
Publikováno v:
Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153).
This paper will focus on significant advances in improving flip chip underfill material cure rates under conventional cure mechanism and in improving the material's reliability, which significantly improves semiconductor packaging productivity. The m
Publikováno v:
Proceedings 4th International Symposium on Advanced Packaging Materials Processes, Properties & Interfaces (Cat No98EX153); 1998, p29-32, 4p
Autor:
Daqing Max Shi, Carbin, J.W.
Publikováno v:
1996 Proceedings 46th Electronic Components & Technology Conference; 1996, p1025-1031, 7p
Conference
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