Zobrazeno 1 - 10
of 53
pro vyhledávání: '"Dao Long Chen"'
Autor:
Hao-Hsi Hung, Yu-Chi Cheng, Sheng-Jye Hwang, Hui-Jing Chang, Bing-Yuan Huang, Hung-Hsien Huang, Dao-Long Chen, Chen-Chao Wang, Chih-Pin Hung
Publikováno v:
Results in Engineering, Vol 23, Iss , Pp 102527- (2024)
During the capillary underfill (CUF) process in flip-chip packaging, issues like incomplete filling, voids, wire sweeping, and overflow can impact product reliability and the relatively long filling time required. Therefore, finding ways to improve f
Externí odkaz:
https://doaj.org/article/a1a6cebf948040eb88ef4d76865ad135
Autor:
Dao-Long Chen, Hui-Jing Chang, Tang-Yuan Chen, Yung-Hsiang Hu, Ting-Bin Chen, Chi-Hung Pan, Yu-Shuo Yang, Sheng-Jye Hwang
Publikováno v:
2023 International Conference on Electronics Packaging (ICEP).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e18c428d7afab619b3ac2c053c35240c
https://doi.org/10.23919/icep58572.2023.10129757
https://doi.org/10.23919/icep58572.2023.10129757
Autor:
Chia-Yu Chen, Yu-Ching Lee, Kuo-Shen Chen, Dao-Long Chen, Yu-Xuan Lin, Wei-Hong Lai, Hung-Chun Yang, Tang-Yuan Chen, Ching-Jenq Ho, Chin-Li Kao
Publikováno v:
2023 International Conference on Electronics Packaging (ICEP).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2fceeb811c1b818e47bcd5db8045692d
https://doi.org/10.23919/icep58572.2023.10129719
https://doi.org/10.23919/icep58572.2023.10129719
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:297-305
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f7fdf5ccbe1e1afb8a1657c96c4e1c4c
https://doi.org/10.1109/tcpmt.2022.3145377
https://doi.org/10.1109/tcpmt.2022.3145377
Autor:
Dao-Long Chen, Huei-Huang Lee, CP Hung, Yu-Shuo Yang, Ian Hu, David Tarng, Yu-Yang Chang, Sheng-Jye Hwang, Bing-Yuan Huang, Bo-Heng Chen
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:174-184
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::da6d3dbc155662f40931133fb0608ee6
https://doi.org/10.1109/tcpmt.2021.3129886
https://doi.org/10.1109/tcpmt.2021.3129886
Publikováno v:
Transactions of Nonferrous Metals Society of China. 31:3929-3942
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::82b4a1ef0021503df423e42830d327d3
https://doi.org/10.1016/s1003-6326(21)65775-8
https://doi.org/10.1016/s1003-6326(21)65775-8
Publikováno v:
International Symposium on Microelectronics. 2021:000228-000233
With the advent of the 5G era, major package and testing plants have been taking frequent action recently. Obviously, with higher and higher performance requirements, SiP is a functional package integrated multiple functional chips, including process
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::85d3851c57f205f85c22f3087bb07afd
https://doi.org/10.4071/1085-8024-2021.1.000228
https://doi.org/10.4071/1085-8024-2021.1.000228
Autor:
Yu-Chin Lee, Chia-Yu Chen, Kuo-Shen Chen, Jen-Hsien Wong, Wei-Hong Lai, Tang-Yuan Chen, Dao-Long Chen, David Tarng
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f8497ce172a170a7ca82398671f61c93
https://doi.org/10.1109/ectc51906.2022.00172
https://doi.org/10.1109/ectc51906.2022.00172
Autor:
Jen-Hsien Wong, NanYi Wu, Wei-Hong Lai, Dao-Long Chen, Tang-Yuan Chen, Chung-Hao Chen, Yi-Hsien Wu, Yung-shun Chang, Chin-Li Kao, David Tarng, Teck Chong Lee, CP Hung
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e159d57d30c49ed080ed9ae30264de6a
https://doi.org/10.1109/ectc51906.2022.00173
https://doi.org/10.1109/ectc51906.2022.00173
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1db4940eb51bf8d0b5993ab4c408736c
https://doi.org/10.1109/ectc51906.2022.00124
https://doi.org/10.1109/ectc51906.2022.00124