Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Danny Morlion"'
Publikováno v:
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
Integration of optical interconnections on a Printed Circuit Board (PCB) is very challenging, as compatibility should be maintained with standard PCB manufacturing technology. This paper describes the use of laser ablation, a technique already used i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0b28869f9e7027f4dadd53648d05af7a
https://doi.org/10.1109/ectc.2004.1320322
https://doi.org/10.1109/ectc.2004.1320322
Autor:
Jan Vandewege, Peter Vetter, J. Van Koetsem, F. Migom, Q. Tan, Danny Morlion, A. Picard, G. De Pestel
Publikováno v:
1996 Proceedings 46th Electronic Components and Technology Conference.
A novel interconnection technology based on the integration of glass optical fibres in a standard printed circuit board is presented to overcome the interconnection bottleneck in the nest generation of broad band switching fabrics. Within these syste
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4486e7dc2d35b23f046c21e1ef04f88a
https://doi.org/10.1109/ectc.1996.517402
https://doi.org/10.1109/ectc.1996.517402
Publikováno v:
IEEE 1997, EMC, Austin Style. IEEE 1997 International Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.97CH36113).
An improved triaxial cell for measuring the transfer impedance of the shields of multipins backplane connectors has been developed. Much attention has been paid to the design of the outer and inner transmission line of the test cell. In particular th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c1abda81722391cb8d3e865b43e601c5
https://doi.org/10.1109/isemc.1997.667557
https://doi.org/10.1109/isemc.1997.667557
Autor:
J. Van Koetsem, Peter Geerinck, S. Van Put, Danny Morlion, G. Van Steenberge, P. Van Daele, Heidi Ottevaere, Hugo Thienpont
Publikováno v:
Vrije Universiteit Brussel
Integration of optical interconnections on a printed circuit board (PCB) is very challenging, since compatibility should be maintained with standard PCB manufacturing technology. This paper describes the use of laser ablation, a technique already use
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6c4be1304ab619ae61180281805b0302
https://researchportal.vub.be/en/publications/3db01f8c-1993-4fa1-85f1-e001867ff6e1
https://researchportal.vub.be/en/publications/3db01f8c-1993-4fa1-85f1-e001867ff6e1
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Conference
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