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pro vyhledávání: '"Daniela White"'
Publikováno v:
Solid State Phenomena. 282:278-283
Chemical Mechanical Planarization (CMP) is a key process for IC manufacturers. Tungsten (W) is an important material for connecting logic elements and for connecting memory elements, thanks to its excellent planarization, filling, mechanical and elec
Autor:
Daniela White, Tal Joseph
Publikováno v:
ECS Journal of Solid State Science and Technology. 10:024006
The ongoing demands for increased storage capacity flash memory in 2D-NAND structures resulted in their replacement by more advanced 3D-NAND structures, with the memory cells made of multiple, vertically stacked silicon oxide/silicon nitride layers.
Autor:
Daniela White, Ruben R. Lieten, Shi Ning Jenq, Herbert Struyf, Thomas Parson, Donald Frye, Lieve Teugels, Michael White
Publikováno v:
Solid State Phenomena. 255:186-194
We discuss several mechanistic approaches and experimental data for improving post-CMP cleaning of W plugs with TiN as barrier liner, and dielectric substrates SiO2 and Si3N4 for use at the 10 nm technology node (metal pitch of 40 nm). Particle charg
Autor:
Daniela, White, Sason, Tavakoli
Publikováno v:
Annals of clinical psychiatry : official journal of the American Academy of Clinical Psychiatrists. 27(3)
Repetitive transcranial magnetic stimulation (rTMS) has shown promising results in treating individuals with behavioral disorders such as major depressive disorder (MDD), posttraumatic stress disorder, obsessive-compulsive disorder, and social anxiet
Autor:
Daniela White, Krzysztof Matyjaszewski
Publikováno v:
Journal of Macromolecular Science, Part A. 34:221-224
Effect of water and oxygen on the polymerization of vinyl acetate initiated by aluminum alkyls, bipyridyls and TEMPO is reported. Reactions with nearly complete exclusion of water and oxygen is very slow and provides a mixture of oligomers in a few h
Publikováno v:
MRS Proceedings. 1249
In this presentation we will discuss polishing performance and related mechanistic aspects of several low solids, low or high pH slurries based on Lewis acids abrasives (TiO2, ZrO2, CeO2), activated by cationic homopolymers, and copolymers with acryl
Publikováno v:
MRS Proceedings. 1249
Difficulties and challenges have been widely encountered in the chemical mechanical planarization (CMP) of noble metals used as diffusion barrier films due to hardness, chemical inertness and toxic oxidation products, in particular for Ru polishing.
Publikováno v:
MRS Proceedings. 991
Nanoparticles provide multiple functionalities to the performance of CMP slurries. These include mechanical surface abrasion, mass transport of slurry chemistries between the pad and wafer surface, or increased chemical reactivity of some key additiv
Autor:
Kim Dean, Victoria L. Graffenberg, David R. Stark, Georgia K. Rich, Andrew J. Blakeney, Thomas Steinhaeusler, Allen H. Gabor, Daniela White, Daniel Miller
Publikováno v:
SPIE Proceedings.
The 193 nm photoresist generation will need several technological approaches in order for it to be successfully integrated into manufacturing. These approaches include bilayer, single layer and top surface imaging resists. Bilayer resists offer the a
Publikováno v:
SPIE Proceedings.
Thermal decomposition of silyl substituted methacrylate terpolymers containing acid sensitive groups was studied using thermogravimetric analysis. The onset of decomposition was found to be a function of the microenvironment, i.e. the molar % composi