Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Daniel Rhee MinWoo"'
Publikováno v:
In Microelectronics Reliability September-November 2013 53(9-11):1548-1552
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Fan-out wafer level packaging (FO-WLP) technology has lots of advantages of small form factor, higher I/O density, cost effective and high performance. However, wafer warpage is one big challenge during wafer process, which needs to be addressed for
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2dafe977914fd9d3e0459276d3536365
https://doi.org/10.1109/ectc.2016.115
https://doi.org/10.1109/ectc.2016.115
Publikováno v:
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
There are five types of die attach materials with high melting point (>250°C) are evaluated in this study, these materials are high lead (Pb95.5Sn2Ag2.5) solder paste, Gold Tin (Au80Sn20) solder paste, pressure-less Silver (Ag) sintered paste, press
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1cfcc78c6f6ac00afd0b03da920d716f
https://doi.org/10.1109/eptc.2014.7028376
https://doi.org/10.1109/eptc.2014.7028376
Autor:
Leong Ching Wai, Daniel Rhee MinWoo, Eric Phua Jian Rong, Wen Wei Seit, Vempati Srinivasa Rao, Mian Zhi Ding
Publikováno v:
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).
In this study, Silver sintering material is being evaluated on different metal surfaces for high temperature storage and high temperature plus high pressure test up to 300°C/30kpsi. Three different type of Alumina based ceramic substrates (gold, sil
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bba561f000729d4a152ba8ae83cac5d7
https://doi.org/10.1109/eptc.2013.6745738
https://doi.org/10.1109/eptc.2013.6745738
Autor:
Michelle Chew Bi-Rong, Eva Wai Leong Ching, Daniel Rhee MinWoo, Vempati Srinivasa Rao, Norhanani Binte Jaafar
Publikováno v:
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).
As device technology is moving towards nano-IC technologies and consumer market are aggressively demands for the miniaturization of electronic products with more functionality [1], the requirement for small IC components has significantly increased,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f10bf706ee9a9d01de427f612ca22724
https://doi.org/10.1109/eptc.2013.6745800
https://doi.org/10.1109/eptc.2013.6745800
Autor:
I Made Riko, Chen Zhong, Wong Chee Cheong, Ahmed Sharif, Daniel Rhee MinWoo, Gan Chee Lip, Eric Phua Jian Rong
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
Epoxy type encapsulation does not suffice in High Pressure High Temperature (HPHT) environment and hence is not suitable for harsh environment applications. In this work, alternative encapsulation methods exploring the use of thickened lid/base and a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::22bb0c1da5a3b66fedba60572585dc64
https://doi.org/10.1109/ectc.2013.6575911
https://doi.org/10.1109/ectc.2013.6575911
Autor:
Lim Ju Dy, Eric Phua Jian Rong, Lim Jun Zhang, Ahmed Sharif, Gan Chee Lip, Daniel Rhee MinWoo, Lau Fu Long, Wong Chee Cheong, Chen Zhong, I Made Riko
Publikováno v:
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).
The concept of Multichip module (MCM) packaging is popularized for evaluating prototypes of novel devices and materials in extreme environmental conditions. The packaging for these types of electronics must be mechanically well-built and the metalliz
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::92aab574f5b71f4a6ca1f7a7bca6f230
https://doi.org/10.1109/eptc.2012.6507053
https://doi.org/10.1109/eptc.2012.6507053