Zobrazeno 1 - 10
of 21
pro vyhledávání: '"Daniel Rhee, Min Woo"'
Publikováno v:
Journal of Electronic Materials. 43:2498-2509
Hermetic sealing of micro-electro mechanical systems (MEMS) sensors for down-hole application requires high-quality void-free bonds, with metallic hermetic sealing being widely used for this purpose. As most of the MEMS sensors cannot withstand high
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::473f3a598166e1aebdd5c42b2f81d6eb
https://doi.org/10.1007/s11664-014-3131-4
https://doi.org/10.1007/s11664-014-3131-4
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
In this paper, authors developed miniaturizeddouble side cooling packaging for SiC (silicon carbide) highpower inverter module using new material solutions towithstand high temperature condition over 220oC. Instead ofconventional thick wire bonding o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e6589bdc2e2773bf709c1894279da6eb
https://doi.org/10.1109/ectc.2016.396
https://doi.org/10.1109/ectc.2016.396
Autor:
Hwang How Yuan, Yeap Yean Wei, Norhanani Binte Jaafar, Lee Jong Bum, Sorono Dexter Velez, Daniel Rhee Min Woo
Publikováno v:
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
While leadframe has come a long way as a cost effective substrate, there is still limitation over its design rule. In this article, the authors have developed and put to test a SiC based PQFN using 70μm single metal layer substrates, allowing furthe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::75e0542139c6a40cad3afef9bb0d1cc4
https://doi.org/10.1109/eptc.2015.7412299
https://doi.org/10.1109/eptc.2015.7412299
Autor:
Jerry Aw Jie Li, Ho Siow Ling, Daniel Rhee Min Woo, Lee Jong Bum, Zhang Songbai, Hwang How Yuan
Publikováno v:
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
The SiC based high power 3 phase inverter module with double side cooling structure was developed. By applying flipchip bonding of SiC based high power DMOSFET device on DBC substrate, the source and gate bonding could be achieved. The drain intercon
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5fb339458533445c5db76715d6d8ba50
https://doi.org/10.1109/eptc.2014.7028383
https://doi.org/10.1109/eptc.2014.7028383
Publikováno v:
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
High power modules are indispensible in our future automotive, aerospace and green & renewable energy industry. However, a lot of issues rise along with the power rising. More components are needed to increase the reliability, dissipate heat and etc.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::af8252d0ea03223b1d6bc3cee37ef71d
https://doi.org/10.1109/eptc.2014.7028368
https://doi.org/10.1109/eptc.2014.7028368
Autor:
Hwang How Yuan, Eva Wai Leong Ching, Gan Chee Lip, Eric Phua Jian Rong, Daniel Rhee Min Woo, Haridas Kuruveettil
Publikováno v:
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
While the advantages of high temperature electronics in the form of hermetic ceramic packaging are numerous, their deployments are being limited by the maximum environmental pressure. Literature [1] has shown that to withstand 30kpsi pressure for ins
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::823ad9cc48c15a3618448aac67ba9cf4
https://doi.org/10.1109/eptc.2014.7028366
https://doi.org/10.1109/eptc.2014.7028366
Publikováno v:
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
The extremely high temperature and high pressure endurable (250°C/30kspi) SOI based temperature sensor and voltage regulator module was developed for harsh environment application such as deep sea, oil & gas down-hole drilling and aerospace engine e
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5fba0da8ae847e23e405449cee29091c
https://doi.org/10.1109/eptc.2014.7028382
https://doi.org/10.1109/eptc.2014.7028382
Publikováno v:
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
Integrated Circuited devices fabricated on SiC instead of Si allows higher operating temperatures for the future automotive, aerospace, and green and renewable energy industry. With higher temperature interfaces and contacts between the chip and pack
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::30c66c9db171820db5530563de01c5d7
https://doi.org/10.1109/eptc.2014.7028357
https://doi.org/10.1109/eptc.2014.7028357
Publikováno v:
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
For downhole drilling applications, packages will have to endure extremely harsh conditions, which can easily reach a temperature of 300°C. At such high temperatures, the commonly adopted solder materials are lead-based as they are more readily avai
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::338f2b4736621a5406269e94721e7498
https://doi.org/10.1109/eptc.2014.7028365
https://doi.org/10.1109/eptc.2014.7028365
Autor:
Eric Phua Jian Rong, Vivek Chidambaram, Chan Yuen Sing, Lee Jong Bum, Hwang How Yuan, Gan Chee Lip, Daniel Rhee Min Woo, Eva Wai Leong Ching
Publikováno v:
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).
As oil and gas industries ventured further and deeper into the earth or ocean in search for new reservoirs, the requirements of depth, pressure and temperature are ever expanding. Conventionally, ceramic based hermetic sealed packaging is used for hi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::172d9ffd1292224209c9e84bf84aa76e
https://doi.org/10.1109/eptc.2013.6745746
https://doi.org/10.1109/eptc.2013.6745746