Zobrazeno 1 - 10
of 99
pro vyhledávání: '"Daniel Pasquet"'
Autor:
Daniel Pasquet, Jan Machac
Publikováno v:
IEEE Microwave Magazine. 19:96-99
Publikováno v:
Radio and Wireless Symposium
Radio and Wireless Symposium, Jan 2019, Orlando, United States
2019 IEEE Radio and Wireless Symposium, RWS 2019
2019 IEEE Radio and Wireless Symposium, RWS 2019, Jan 2019, Florida, United States. pp.8714439, ⟨10.1109/RWS.2019.8714439⟩
Radio and Wireless Symposium, Jan 2019, Orlando, United States. pp.1-4, ⟨10.1109/RWS.2019.8714439⟩
RWS
Radio and Wireless Symposium, Jan 2019, Orlando, United States
2019 IEEE Radio and Wireless Symposium, RWS 2019
2019 IEEE Radio and Wireless Symposium, RWS 2019, Jan 2019, Florida, United States. pp.8714439, ⟨10.1109/RWS.2019.8714439⟩
Radio and Wireless Symposium, Jan 2019, Orlando, United States. pp.1-4, ⟨10.1109/RWS.2019.8714439⟩
RWS
International audience; This paper shows the VNA calibration for a DUT with a differential input and a single output embedded into a measurement board. Simulations have validated the concept. © 2019 IEEE.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::da4153e752faedab97d824bc9cc6e06c
https://hal.archives-ouvertes.fr/hal-02023549
https://hal.archives-ouvertes.fr/hal-02023549
Publikováno v:
Microwave and Optical Technology Letters
Microwave and Optical Technology Letters, Wiley, 2018, Volume 60 (issue 11), ⟨10.1002/mop.31473⟩
Microwave and Optical Technology Letters, Wiley, 2018, Volume 60 (issue 11), ⟨10.1002/mop.31473⟩
International audience; Semiconductor devices are tested within a complex environment including a loadboard and a socket. In this paper, we propose a calibration methodology and a RF de‐embedding technique that allows the extraction of the device p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7e0d370ac25b5f646e85043fb580e25b
https://hal.archives-ouvertes.fr/hal-02190700
https://hal.archives-ouvertes.fr/hal-02190700
Publikováno v:
IEEE Microwave Magazine. 17:75-88
Autor:
Kassem Hamze, Philippe Descamps, Cedric Mayor, Daniel Pasquet, Christian Gautier, Dominique Lesenechal
Publikováno v:
2018 22nd International Microwave and Radar Conference (MIKON).
The variation of the linear inductance of a CPW with the frequency is used to extract the effective permeability that depends on the metallic losses. The result allows to separate the dielectric and metallic losses and to calculate some characteristi
Publikováno v:
IEEE Microwave Magazine. 20:114-115
Publikováno v:
Mediterranean Microwave Symposium (MMS)
Mediterranean Microwave Symposium (MMS), Nov 2017, Marseille, FRANCE, France. ⟨10.1109/MMS.2017.8497066⟩
Mediterranean Microwave Symposium (MMS), Nov 2017, Marseille, France. pp.1-3, ⟨10.1109/MMS.2017.8497066⟩
Mediterranean Microwave Symposium (MMS), Nov 2017, Marseille, FRANCE, France. ⟨10.1109/MMS.2017.8497066⟩
Mediterranean Microwave Symposium (MMS), Nov 2017, Marseille, France. pp.1-3, ⟨10.1109/MMS.2017.8497066⟩
International audience; A bended and straight coplanar waveguides are modeled by using HFSS 3D electromagnetic software. The behavior of bend CPW is described by matrix calculations in order to show the effect of the parasitic even mode on the propag
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::dc1feb772251950247becc0b57134bf7
https://hal-normandie-univ.archives-ouvertes.fr/hal-02175434
https://hal-normandie-univ.archives-ouvertes.fr/hal-02175434
Publikováno v:
IEEE Microwave Magazine. 16:104-107
This article focuses on a recent IEEE Microwave Theory and Techniques Society (MTT-S) initiative, conceived by the Membership and Geographical Activities Committee (MGA-C) of the Society’s Administrative Committee (AdCom). Its aim is to develop mem
Autor:
Jan Machac, Daniel Pasquet
Publikováno v:
IEEE Microwave Magazine. 16:146-149
Autor:
Pierre Nicole, Dominique Lesenechal, Thanh Vinh Dinh, Philippe Descamps, Julien Pagazani, Gaelle Lissorgues, Daniel Pasquet
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology, Institute of Electrical and Electronics Engineers, 2015, 5 (1), pp.119-127. ⟨10.1109/TCPMT.2014.2366730⟩
IEEE Transactions on Components Packaging and Manufacturing Technology Part B
IEEE Transactions on Components Packaging and Manufacturing Technology Part B, Institute of Electrical and Electronics Engineers (IEEE), 2015, 5 (1), pp.119-127. ⟨10.1109/TCPMT.2014.2366730⟩
IEEE Transactions on Components Packaging and Manufacturing Technology Part B, 2015, 5 (1), pp.119-127. ⟨10.1109/TCPMT.2014.2366730⟩
IEEE Transactions on Components, Packaging and Manufacturing Technology, Institute of Electrical and Electronics Engineers, 2015, 5 (1), pp.119-127. ⟨10.1109/TCPMT.2014.2366730⟩
IEEE Transactions on Components Packaging and Manufacturing Technology Part B
IEEE Transactions on Components Packaging and Manufacturing Technology Part B, Institute of Electrical and Electronics Engineers (IEEE), 2015, 5 (1), pp.119-127. ⟨10.1109/TCPMT.2014.2366730⟩
IEEE Transactions on Components Packaging and Manufacturing Technology Part B, 2015, 5 (1), pp.119-127. ⟨10.1109/TCPMT.2014.2366730⟩
International audience; The dependence of self-inductance and mutual inductance on bonding wire (BW) geometric profile has been studied in several papers. This paper will present a method using a BW-geometric-profile-dependent term to include this de