Zobrazeno 1 - 10
of 22
pro vyhledávání: '"Daniel Nilsen Wright"'
Autor:
Daniel Nilsen Wright, Mark Züchner, Eis Annavini, Manuel J. Escalona, Lena Hammerlund Teige, Lars Geir Whist Tvedt, Andreas Lervik, Henning A. Haga, Thomas Guiho, Ingelin Clausen, Thomas Glott, Jean-Luc Boulland
Publikováno v:
Scientific Reports, Vol 14, Iss 1, Pp 1-10 (2024)
Abstract Pressure monitoring in various organs of the body is essential for appropriate diagnostic and therapeutic purposes. In almost all situations, monitoring is performed in a hospital setting. Technological advances not only promise to improve c
Externí odkaz:
https://doaj.org/article/333efe4b26e84342b943d9f66cf4f5bc
Autor:
Raphael Schuler, Daniel Nilsen Wright, M. Stange, Joachim Moe Graff, Matthias Schrade, Ole Martin Løvvik, Gustavo Castillo-Hernandez, Xin Song, Johannes de Boor, Gunstein Skomedal, Erik Enebakk
Publikováno v:
Journal of Electronic Materials
Thermoelectric modules can be used in waste heat harvesting, sensing, and cooling applications. Here, we report on the fabrication and performance of a four-leg module based on abundant silicide materials. While previously optimized Mg2Si0.3Sn0.675Bi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ab0f7f26019c5c9f6966807e7065ea9a
https://hdl.handle.net/11250/3047820
https://hdl.handle.net/11250/3047820
Most available fine pitch interconnects, like micro bumps and copper pillars, are not particularly compliant whereas available compliant interconnects, like plastic core solder balls, are not fine pitch. Using Ag plated polymer spheres (MPS) in conju
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::216fbd0d8e28cbce0aea46f5ed5f1ba9
Publikováno v:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)
It is well known that the packaging of electronic devices is of paramount importance, none more so than in MEMS were fragile mechanical elements are realized. Among the different approaches, wafer to wafer bonding guarantees the advantages of the waf
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a7e9e4155626483f5db608e6511816b7
https://hdl.handle.net/11250/3048912
https://hdl.handle.net/11250/3048912
Autor:
Sigurd Hovden, Mikael Syväjärvi, Alexander Azarov, Quan-Bao Ma, Daniel Nilsen Wright, Ole Martin Løvvik, Annett Thøgersen, Valdas Jokubavicius, Spyros Diplas, Augustinas Galeckas, Bengt Gunnar Svensson, Jianwu Sun, Patricia Almeida Carvalho
Publikováno v:
Materials Science Forum. 924:221-224
In this work, a complementary microstructural and optical approach is used to define processing conditions favorable for the formation of deep boron-related acceptor centers that may provide a pathway for achieving an intermediate band behavior in hi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9284add62b848d8fb6ba8c3195851d7c
https://doi.org/10.4028/www.scientific.net/msf.924.221
https://doi.org/10.4028/www.scientific.net/msf.924.221
Autor:
Tomas Sollund, Bjorn Tveit, Maaike M. Visser Taklo, Per Dalsjo, Christian H. Johnsen, Helge Kristiansen, Daniel Nilsen Wright, Susanne Helland, Jakob Gakkestad
Publikováno v:
IEEE Transactions on Components, Packaging, and Manufacturing Technology
A very compact and rugged 2.5-D integrated data logger has been built and tested. The data logger is capable of measuring accelerations exceeding 70 000 g. Microcontroller and flash memory as bare dies have been mounted onto a silicon interposer with
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f519a66ab43bc23e93f3bcd9bcda5688
https://doi.org/10.1109/tcpmt.2017.2766263
https://doi.org/10.1109/tcpmt.2017.2766263
Autor:
Olle Hagel, Huiting Jin, Sigbjørn Kolberg, Maaike M. Visser Taklo, Annelie Eveborn, Daniel Nilsen Wright, Torbjorn Eriksson, Kjell Olafsen, Alexandre Garcia
Publikováno v:
International Symposium on Microelectronics. 2017:000663-000668
Electrochromic displays are among the key components of smart tags and their performance, defined by the color switch time, is directly linked to the level of humidity inside the displays. A time-efficient procedure, based on the use of a gravimetric
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aa318889bdd4a7cced83a384e7c18b5d
https://doi.org/10.4071/isom-2017-poster4_131
https://doi.org/10.4071/isom-2017-poster4_131
Autor:
Andreas Vogl, Faycal Hamou, Helge Kristiansen, Daniel Nilsen Wright, Sigbjørn Kolberg, Erik Kalland, Thor Bakke, Maaike M. Visser Taklo, Astrid-Sofie B. Vardoy
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2017:1-25
Low cost and miniaturized solutions for assembly of optical microelectromechanical systems (MOEMS) are critical for increased exploitation of optical sensors and devices in consumer applications. Examples of applications based on optical sensors and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1a2e6a42b7223979dc870cafb8254951
https://doi.org/10.4071/2017dpc-tha3_presentation3
https://doi.org/10.4071/2017dpc-tha3_presentation3
Autor:
Hoang-Vu Nguyen, Daniel Nilsen Wright, Maaike M. Visser Taklo, Branson D. Belle, Helge Kristiansen, Jakob Gakkestad, Kari Schjølberg-Henriksen
Publikováno v:
International Symposium on Microelectronics. 2016:000044-000049
An anisotropic conductive film (ACF) can be utilized to simultaneously form mechanical bonds and electrical connections during flip-chip assembly. The electrical connection is created by trapping randomly dispersed metallized polymer spheres (MPS) in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::50194e8d9a6eae58ce86be4ebe1f0cd1
https://doi.org/10.4071/isom-2016-tp23
https://doi.org/10.4071/isom-2016-tp23
Autor:
Susanne Helland, Ottar Opland, Maaike M. Visser Taklo, Jakob Gakkestad, Daniel Nilsen Wright, Helge Kristiansen, Per Dalsjo
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2016:1-6
Polymer Core Solder Balls (PCSB) have been used as interconnects between a 16 pin leadless chip carrier (LCC) ceramic package and a small FR4 board. A comparison was made between two different volumes of SnPb solder and an isotropic conductive adhesi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8c0773caee65c243fb9f8064a7b54064
https://doi.org/10.4071/2016-nor-gakkestad
https://doi.org/10.4071/2016-nor-gakkestad