Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Daniel N. Maynard"'
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing. 21:329-336
Today's sophisticated design-for-manufacturability (DFM) methodologies provide a designer with an overwhelming amount of choices, many with significant costs and unclear value. The technology challenges of subwavelength lithography, new materials, de
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::065e1573dcc2c516adf1fee1d99c212a
https://doi.org/10.1109/tsm.2008.2001206
https://doi.org/10.1109/tsm.2008.2001206
Autor:
J. Gambino, Charles F. Musante, K. Ackerson, John Ellis-Monaghan, Daniel N. Maynard, Mark D. Jaffe, Kevin N. Ogg, Richard J. Rassel
Publikováno v:
2008 IEEE/SEMI Advanced Semiconductor Manufacturing Conference.
CMOS image sensors have increasingly replaced the use of charge coupled devices (CCD) in consumer devices because of lower power consumption, lower system cost, and the ability to randomly access data. However, one disadvantage of CMOS image sensors
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8613aaf1b64bf6f357b4bf0b7f53434a
https://doi.org/10.1109/asmc.2008.4529048
https://doi.org/10.1109/asmc.2008.4529048
Autor:
Daniel N. Maynard, Jason D. Hibbeler
Publikováno v:
IEEE/SEMI Conference and Workshop on Advanced Semiconductor Manufacturing 2005..
The semiconductor industry recognizes critical area as the scientific cornerstone metric of a design's fault sensitivity. The ability to accurately and quickly extract critical areas is mandatory when considering design for manufacturability (DFM) mo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f792ca9743c26f2b786cd0dc393e5a6e
https://doi.org/10.1109/asmc.2005.1438803
https://doi.org/10.1109/asmc.2005.1438803
Autor:
Kevin W. McCullen, Jason D. Hibbeler, Mark A. Lavin, Nakgeuon Seong, Daniel N. Maynard, Lars W. Liebmann, Ed Buturla
Publikováno v:
Design and Process Integration for Microelectronic Manufacturing III.
Two primary tracks of DfM, one originating from physical design characterization, the other from low-k 1 lithography, are described. Examples of specific DfM efforts are given and potentially conflicting layout optimization goals are pointed out. The
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::39421595cfc9086e65190a6806de59d9
https://doi.org/10.1117/12.604723
https://doi.org/10.1117/12.604723
Publikováno v:
2004 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (IEEE Cat. No.04CH37530).
Recent years have seen interest in design for manufacturability (DFM) blossom in response to rapidly increasing technology and design complexity. Many semiconductor manufacturers have focused their efforts on productivity and, more specifically, yiel
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e8cb804a986fced0bc0a0389151be632
https://doi.org/10.1109/asmc.2004.1309544
https://doi.org/10.1109/asmc.2004.1309544
Publikováno v:
13th Annual IEEE/SEMI Advanced Semiconductor Manufacturing Conference. Advancing the Science and Technology of Semiconductor Manufacturing. ASMC 2002 (Cat. No.02CH37259).
Historically, physical design characterization (PDC) has been the focus of product or design engineers. This paper introduces PDC from a manufacturing perspective and the value of design-specific information for successful process control. Several PD
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::921a5c78ca9e6d4443ec95eb38320d01
https://doi.org/10.1109/asmc.2002.1001612
https://doi.org/10.1109/asmc.2002.1001612
Publikováno v:
2001 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (IEEE Cat. No.01CH37160).
Since the semiconductor industry has aggressively shortened product development cycles, characterizing and solving design-process sensitivities has seen a drastic reduction in the "window of opportunity". Thus, many semiconductor fabricators must bui
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7234989357adeef48d3354c532f873f2
https://doi.org/10.1109/asmc.2001.925639
https://doi.org/10.1109/asmc.2001.925639
Publikováno v:
Fiber Optic and Laser Sensors VII.
The use of frequency ramped (chirped) laser diode sources has increased dramatically through their use in interferometric heterodyne systems, fiber fault location systems, and fiber sensor multiplexing. Frequency chirping is typically achieved via ei
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c486371bacfa5a698674fd02ff2a77c1
https://doi.org/10.1117/12.963024
https://doi.org/10.1117/12.963024
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