Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Daniel Min Woo Rhee"'
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
A new characterization method for interfacial adhesion between die to die hybrid bonding interface at chip level is developed to evaluate and analyze the adhesion strength. Die to wafer or die to die hybrid bonding and stacking is very promising sche
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1b780c525127f6c6d412cc86eb9b5b8b
https://doi.org/10.1109/ectc32696.2021.00277
https://doi.org/10.1109/ectc32696.2021.00277
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
In this study, a numerical methodology to predict package warpage considering viscoelasticity with cure-kinetics during thermal process was proposed. When a package undergoes thermal condition, residual stress between layers occurs. The residual stre
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::763e3edf3efcceb985d37f82256ca841
https://doi.org/10.1109/ectc32696.2021.00235
https://doi.org/10.1109/ectc32696.2021.00235
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Direct wafer bonding process is applied in semiconductor production because of the advantage of attaching several chips at once. During the bonding process, the top wafer is deformed and the wafer surface is oblique from the bonding front to the edge
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::414ab46407f05dfc81d59f0f844092b9
https://doi.org/10.1109/ectc32862.2020.00258
https://doi.org/10.1109/ectc32862.2020.00258
Autor:
Daniel Min Woo Rhee
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
A new estimation technique for interfacial reaction between amine-epoxy based resin and nano scale silica filler suspension system is developed to explain the thermal process of non-conductive paste (NCP) materials for microelectronic flip-chip packa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::58e373ef1e678a357acc2cf94917efb3
https://doi.org/10.1109/ectc32862.2020.00317
https://doi.org/10.1109/ectc32862.2020.00317
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 7:50-57
Microfluid cooling solution is one of the most effective techniques for thermal management of high heat fluxes. A jet-based Si microcooler with multiple drainage microtrenches (MDMTs) has been developed for microelectronic thermal management. Integra
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7d6529da9751a74f3a4161575906e204
https://doi.org/10.1109/tcpmt.2016.2627040
https://doi.org/10.1109/tcpmt.2016.2627040
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 6:729-739
In this paper, a compact and efficient single-phase liquid cooling system is developed for the microelectronic devices with high-power dissipation, such as the high performance servers, power amplifiers, and airborne systems. The developed system inc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::182b759d238e366ee67fba8a7c03ab87
https://doi.org/10.1109/tcpmt.2016.2542848
https://doi.org/10.1109/tcpmt.2016.2542848
Publikováno v:
Applied Surface Science. 355:509-515
A number of surface pre-treatments have been studied for their effectiveness on the adhesion strength between magnetron sputtered copper (Cu) thin film and polycrystalline alumina (Al2O3) substrate. The treatments include organic solvent cleaning, ac
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8653dc00603b87830efc3b5e2ad2d3f0
https://doi.org/10.1016/j.apsusc.2015.07.141
https://doi.org/10.1016/j.apsusc.2015.07.141
Publikováno v:
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
In this paper, the power cycling simulation model was built up to study the thermo-mechanical reliability of the power electronic package test vehicle with single metal layer flexible substrate. The power cycling simulation includes thermal analysis
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cec55cf8e2f0d447baa71ea8809dc5b4
https://doi.org/10.1109/eptc.2015.7412307
https://doi.org/10.1109/eptc.2015.7412307
Publikováno v:
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
Silicon carbide based power modules are receiving more attention due to their performance advantages over traditional silicon power modules. The demanding operation requirements such as higher power output, faster switching speed, and higher working
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cf27a619895e7c2aee0023811d1d1f3e
https://doi.org/10.1109/eptc.2014.7028370
https://doi.org/10.1109/eptc.2014.7028370