Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Daniel Lee Revier"'
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
This paper outlines the fundamental principles and processing characteristics of realizing application-specific "smart"' microelectronic packages utilizing fully-additive inkjet and 3D printing fabrication technologies. Standard square encapsulants a
Autor:
Wenjing Su, Manos M. Tentzeris, Christy D. Saintsing, Jo Bito, Anya Traille, John Kimionis, Sangkil Kim, Benjamin Stassen Cook, Jimmy Hester, Taoran Le, Bijan Tehrani, Daniel Lee Revier
Publikováno v:
Proceedings of the IEEE. 103:583-606
Inkjet printing on flexible paper and additive manufacturing technologies (AMT) are introduced for the sustainable ultra-low-cost fabrication of flexible radio frequency (RF)/microwave electronics and sensors. This paper covers examples of state-of-t
Autor:
Manos M. Tentzeris, Daniel Lee Revier
Publikováno v:
RWS
This research introduces a low-cost, single-platform hybrid manufacturing process for realizing canonical and wideband antenna structures. This work outlines the printing processes of thick dielectrics & thin metallic geometries in coordination with
Autor:
Benjamin Stassen Cook, Chiara Mariotti, Bijan Tehrani, Luca Roselli, Manos M. Tentzeris, Daniel Lee Revier, James Cooper, Luca Aluigi
Vertically-integrated inkjet-printed inductors and transformers are demonstrated for the first time with high levels of performance and repeatability. The inductive components are fabricated using a well-characterized multi-layer inkjet printing proc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b3486191153a697ce79afe8f9250e453
http://hdl.handle.net/11391/1243897
http://hdl.handle.net/11391/1243897