Zobrazeno 1 - 10
of 24
pro vyhledávání: '"Daniel J. D. Sullivan"'
The book presents a unique view of failure analysis of high technology devices. It describes capabilities and limitations of many analytical techniques and testing paths and decisions best followed in example failure analysis studies.
Autor:
Daniel J. D. Sullivan, E. R. Behringer, Harris C. Flaum, D. P. Masson, Andrew C. Kummel, E. J. Lanzendorf
Publikováno v:
The Journal of Physical Chemistry. 99:12863-12874
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8a558427c69f71730d27f7b59d235dc9
https://doi.org/10.1021/j100034a027
https://doi.org/10.1021/j100034a027
Publikováno v:
The Journal of Chemical Physics. 101:1582-1594
The effects of surface temperature (Ts) and surface structure upon the passivation and etching of GaAs(100) and GaAs(110) surfaces by Cl2 have been studied. The Ga‐rich GaAs(100) Ga‐c(8×2) and the stoichiometric GaAs(110) (1×1) surfaces form st
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::92110f27169640dfbb705c1969658a4e
https://doi.org/10.1063/1.467779
https://doi.org/10.1063/1.467779
Publikováno v:
The Journal of Physical Chemistry. 98:1719-1731
Chemisorption probabilities (S) of monoenergetic I 2 , Br 2 , Cl 2 , and C 6 H 5 Cl beams have been measured on the Si(100)(2×1) surface. The sticking probabilities (S) were measured as a function of the incident translational energy (E i ), the sur
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b479ce324cd20be06f7306f2f2dba49f
https://doi.org/10.1021/j100057a028
https://doi.org/10.1021/j100057a028
Publikováno v:
The Journal of Chemical Physics. 100:1634-1648
Initial sticking probabilities are measured for monoenergetic molecular chlorine upon the Ga‐rich GaAs(100) c(8×2), As‐rich GaAs(100) c(2×8), and stoichiometric GaAs(110)(1×1) surfaces. The sticking probabilities are measured as a function of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7e3e9a7bc247a93b99fce0a66ec29fb6
https://doi.org/10.1063/1.466591
https://doi.org/10.1063/1.466591
Autor:
Daniel J. D. Sullivan, Jesse A. Guzman
Publikováno v:
International Symposium for Testing and Failure Analysis.
Scanning acoustic microscopy (SAM) has been in use for the analysis of small devices, mostly ICs, for quite some time. [1] This paper address the use of the technique on larger objects, such as solar panels, PCBs, and brazed cooling plates, the issue
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e005d2b99328c2ed75a78f41e8ac9e19
https://doi.org/10.31399/asm.cp.istfa2011p0377
https://doi.org/10.31399/asm.cp.istfa2011p0377
Publikováno v:
Review of Scientific Instruments. 63:4285-4288
Here we describe the design, construction, and operation of an ultrahigh‐vacuum manipulator for combined molecular beam and scanning tunneling microscopy experiments. The manipulator allows (1) sample transfer, (2) liquid‐nitrogen cooling, (3) el
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::da76033a4e37ec5c0606703d06b41a13
https://doi.org/10.1063/1.1143726
https://doi.org/10.1063/1.1143726
Publikováno v:
International Symposium for Testing and Failure Analysis.
Scanning acoustic microscopy (SAM) is a non-destructive tool for analysis of packaged devices. New materials, package configurations, and technologies have required adaptation of standard practices in SAM. The detection of cracked die, voids, or dela
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6e7ef826b85de0bd47724f1a8c34fd85
https://doi.org/10.31399/asm.cp.istfa2005p0199
https://doi.org/10.31399/asm.cp.istfa2005p0199
Publikováno v:
International Symposium for Testing and Failure Analysis.
Acoustic Micro Imaging (AMI) is an established nondestructive technique for evaluation of electronic packages. Non-destructive evaluation of electronic packages is often a critical first step in the Failure Analysis (FA) process of semiconductor devi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7d0c5aa20551ccaf3f064a2c555993ef
https://doi.org/10.31399/asm.cp.istfa2004p0389
https://doi.org/10.31399/asm.cp.istfa2004p0389