Zobrazeno 1 - 10
of 22
pro vyhledávání: '"Daniel Ismael"'
Autor:
Daniel Ismael Gómez
Publikováno v:
Rey Desnudo: Revista de Libros, Vol 4, Iss 7 (2015)
Externí odkaz:
https://doaj.org/article/001975c566854e958212ebad177d845a
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::66273678032bb5fd80b30468d194aba7
https://doi.org/10.1109/eptc56328.2022.10013188
https://doi.org/10.1109/eptc56328.2022.10013188
Publikováno v:
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
Non-Conductive Film (NCF) is one of the packaging technology used for micro-bump flip chip bonding beside capillary underfill. The bonding process used with the NCF need to be optimized to avoid NCF fillet entrapment inside the solder material and al
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9e5762d2687c643258bd88c2ae6cd270
https://doi.org/10.1109/eptc.2018.8654388
https://doi.org/10.1109/eptc.2018.8654388
Publikováno v:
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
For the study of active device effect by fan-out wafer level packaging process, fan-out assembly processes were simulated by using actual CMOS device wafers as carrier to study the device performance effect. The I d V d and I d V g of 65nm technology
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6e2e7eb97b6679aa4d3079ce726ae1a9
https://doi.org/10.1109/eptc.2018.8654434
https://doi.org/10.1109/eptc.2018.8654434
Publikováno v:
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
Present study focuses on high aspect ratio Thru Mold Via (TMV) fabrication using nanosecond laser drill tool. Epoxy mold compound (EMC) with 25um filler size is used to demonstrate 50um diameter TMV. Smaller via size with increase in high I/O count a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::af6e3654c2dc733b242e18e418cf88fb
https://doi.org/10.1109/eptc.2018.8654286
https://doi.org/10.1109/eptc.2018.8654286
Publikováno v:
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC).
Non-Conductive Film (NCF) is an attractive option for tacking the chip on the wafer before sending the tacked sample to gang bonder to form the solder interconnects. Chip on Wafer (CoW) bonding is a preferred choice over wafer to wafer bonding as it
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1d08395f8a9010f064897810fd1fe78a
https://doi.org/10.1109/eptc.2017.8277433
https://doi.org/10.1109/eptc.2017.8277433
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
Cu-Cu is a prefer choice of interconnects as it offered lower electrical resistance, no risk of shorting between the bump and higher reliability as compared to Cu-Solder Bump. However, Cu-Cu interconnect requests stringent condition such as Cu bump s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ddd647dbcdabdadb7897aaf2f64411ca
https://doi.org/10.1109/ectc.2017.260
https://doi.org/10.1109/ectc.2017.260
Autor:
David Ho, Daniel Ismael, Chong Ser Choong, Ding Mian Zhi, Vempati Srinivasa Rao, Sharon Lim Ps, Chai Tai Chong, Ye Yong Liang
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
This paper presents, the development of large multi-chip fan-out wafer level package (FOWLP) based Package-on-Package (PoP) using mold-First FOLWP integration flow for mobile applications. As part of this development, conventional mold-First FOWLP wa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2d5389cb0a433970a6e6ba0f515545fb
https://doi.org/10.1109/ectc.2017.122
https://doi.org/10.1109/ectc.2017.122
Autor:
Leong Ching Wai, Boon Long Lau, Vempati Srinivasa Rao, Hsiang-Yao Hsiao, Soon Ann Sek, Tai Chong Chai, Soon Wee Ho, Daniel Ismael Cereno
Publikováno v:
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
Through mold interconnects (TMI) is a key enabler for fan-out wafer level packaging (FOWLP) for 3D integration. Three different types of TMI have been developed for both mold-first and RDL-first fabrication flow. The three types of TMI consist of las
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::016023af0b42b423f8da1e81755d3a71
https://doi.org/10.1109/eptc.2016.7861441
https://doi.org/10.1109/eptc.2016.7861441
Publikováno v:
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
Ultra-fine pitch (6μm) interconnects are essential for high-end application-products that demands high speed and high bandwidth inter-chip communication. Achieving Cu-Cu bonding with such a fine pitch is challenging since bond time is too long and b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5eab4e6e78501cf5762528c41adcce74
https://doi.org/10.1109/eptc.2016.7861452
https://doi.org/10.1109/eptc.2016.7861452