Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Daniel Greenslit"'
Autor:
Zhigang Song, Tarl Gordon, Teng-Yin Lin, Kan Zhang, Neerja Bawaskar, Steve Crown, Yandong Liu, Martin O'tool, Kannan Sekar, Toni Laaksonen, Daniel Greenslit, Mark Lagus, Ishtiaq Ahsan, Bill Evans, Joerg Winkler, Shahrukh Khan, DK Sohn, Frank Barth, John Masnik
Publikováno v:
2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
Functional logic test structures with ATPG blocks and scan chains have been the traditional inline logic learning vehicle for technology learning and development. However, these test structures often need processing of wafers up to a higher BEOL proc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::af9c6803b34a79dc6e26839fa55284f7
https://doi.org/10.1109/asmc.2019.8791769
https://doi.org/10.1109/asmc.2019.8791769
Autor:
Eric Eisenbraun, Daniel Greenslit
Publikováno v:
ECS Transactions. 35:17-24
RuCo films have been grown by plasma enhanced atomic layer deposition (PEALD) and investigated as a novel direct plate liner for advanced copper metallization. The RuCo films were characterized by transmission electron microscope (TEM) and found to f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a01c6f06422c0312c907447eed9310f9
https://doi.org/10.1149/1.3646496
https://doi.org/10.1149/1.3646496
Publikováno v:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 27:572-576
A novel plasma-enhanced atomic layer deposition-grown mixed-phase/nanolaminate Ru–TaN barrier has been investigated, and it was confirmed that the copper diffusion barrier and direct-plate characteristics of the mixed-phase barrier can be modulated
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::edd8b415f9930b239572a0737d59c2cb
https://doi.org/10.1116/1.3122664
https://doi.org/10.1116/1.3122664
Publikováno v:
Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena. 29:030605
A study has been carried out to understand the mechanism that enables plasma enhanced atomic layer deposition (PEALD)-grown RuTaN barriers to support direct (seedless) copper electroplating. In particular, the effects of changing the liner surface ch
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::86a987de8c850e37832f2430ad983a6b
https://doi.org/10.1116/1.3585664
https://doi.org/10.1116/1.3585664
Publikováno v:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 27:631
A novel mixed phase Ru–WCN film grown by plasma-enhanced atomic layer deposition has been investigated as a novel direct-plate liner for advanced copper metallization. Ru–WCN films were grown using a nanolaminate approach, and the properties of t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::77432178bcc447f949aba36787a3b59b
https://doi.org/10.1116/1.3097856
https://doi.org/10.1116/1.3097856
Publikováno v:
ECS Meeting Abstracts. :752-752
A novel mixed phase Ru-WCN film grown by plasma enhanced atomic layer deposition (PEALD) has been investigated as a novel direct plate liner for advanced copper metallization. Ru/WCN films have been grown using a nanolaminate approach. Preliminary re
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::03301195fd296dee99fe9fb916ec706a
https://doi.org/10.1149/ma2008-01/19/752
https://doi.org/10.1149/ma2008-01/19/752
Publikováno v:
ECS Meeting Abstracts. :861-861
A novel plasma enhanced atomic layer deposition (PEALD)-grown mixed-phase/nano-laminate barrier has been developed which combines the robust barrier properties of TaN with direct plate characteristics of Ru. Preliminary investigation indicates that R
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8f5287cd09ee87119247716ea65401fc
https://doi.org/10.1149/ma2007-01/18/861
https://doi.org/10.1149/ma2007-01/18/861