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Enhanced Sample Preparation of Cu Low-k Semiconductors via Mechanical Polishing and Ion Beam Etching
Autor:
Daniel Flatoff, Shane Roberts
Publikováno v:
Microscopy Today. 12:41-43
Modern microelectronics have rapidly decreased in geometry to enhance the speed and processing power of computers. Advanced devices are approaching design rules of sub 0.13 micron in size, and the trend continues at the rate dictated by Moore's Law,
Autor:
Esther Chen, Jeremy D. Russell, Daniel Flatoff, Nicolas LaManque, Bianzhu Fu, Wayne Zhao, Stephen Mongeon
Publikováno v:
Microscopy and Microanalysis. 20:362-363
Introductions of 3-Dimentional FinFET transistors in semiconductor device open a new era for continuous shrinkage of semiconductor transistor nodes. One big challenge for physical failure analysis (PFA) and transmission electron microscopy (TEM) is t
Publikováno v:
Microscopy and Microanalysis. 9:810-811