Zobrazeno 1 - 10
of 101
pro vyhledávání: '"Daniel F. Downey"'
Publikováno v:
Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms. 237:365-371
Advances in reducing the sizes of device structures and line widths place increasing demands on the accuracy of dopant placement and the control of dopant motion during activation anneals. Serial process high current ion implantation systems seek to
Publikováno v:
Microelectronics Journal. 36:522-526
Characterization of the inactive clusters formed by high dose implantation silicon are one of the crucial topics in the semiconductor industry. Analytical techniques, which could provide quantitative information on the detailed description of the com
Autor:
Daniel F. Downey, Edwin A. Arevalo, Wolfgang Skorupa, Rossen Yankov, Matthias Voelskow, Thoralf Gebel, Wolfgang Anwand
Publikováno v:
Materials Science and Engineering: B. :358-361
The capabilities of plasma doping (PLAD) and flash lamp annealing (FLA) for use in ultra-shallow junction (USJ) fabrication have been evaluated. Silicon wafers have been doped in a BF 3 plasma using wafer biases ranging from 0.6 to 1 kV and a dose of
Publikováno v:
Journal of Applied Physics. 93:2449-2452
The defect evolution upon annealing of low energy, amorphizing germanium implants into silicon was studied using plan-view transmission electron microscopy. Implants with energies of 5–30 keV at an amorphizing dose of 1×1015 Ge+ cm−2 were anneal
Publikováno v:
Journal of Electronic Materials. 28:1340-1344
The effects of “fast” ramp-rates (up to 425°C/s) and spike anneals are investigated for 0.25 keV, 0.5 keV, and 1.0 keV 11B+ and for 1.1 and 2.2 keV BF2 at a dose of 1e 15/cm2. Below an implant energy threshold where no extended defects form, fas
Autor:
Steven D. Marcus, Daniel F. Downey, Wilfried Lerch, M. Glück, N. A. Stolwijk, H. Walk, Judy W. Chow, M. Schäffer
Publikováno v:
Journal of The Electrochemical Society. 146:2670-2678
For the formation of ultrashallow junctions, a controlled gaseous ambient during rapid thermal annealing is indispensible. To understand the diffusion/activation mechanism, the influencing and depending variables have to be clarified precisely. Ion i
Publikováno v:
Journal of Electronic Materials. 27:1291-1295
Ion implants of 2.0 and 5.0 keV 11B+ and 2.2, 5.0, and 8.9 keV 49BF2+ at a dose of 1E15/cm2 were investigated. Anneal conditions were developed which produced highly activated yet shallow junctions. The effects of oxygen were studied previously by us
Publikováno v:
Journal of Electronic Materials. 27:1296-1314
The effects of time, temperature, ramp-up, and ramp-down rates with rapid thermal annealing employing a STEAG AST SHS3000 were investigated on 1.0 and 2.0 keV 11B+, 2.2, 5.0, and 8.9 keV 49BF 2 + , and 2 KeV 75As+, 1E15/cm2 samples implanted in a Var
Publikováno v:
Thin Solid Films. :562-569
11B+ and 49BF2+ implants on a Varian VIISion-80 PLUS Ion Implanter from 2.0 to 8.9 keV at a dose of 1E15/cm2, and at various controlled and measured (in situ) peak beam-current densities, ranging from 3 to 600 μA/cm2, were investigated to study the
Autor:
Daniel F. Downey, G.C. Angel
Publikováno v:
Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms. 96:68-74
As+, 80 keV implants at specification beam currents were conducted on both the Varian E1000 and E220/E500 implanters to study metals contamination. The E1000 was configured with a silicon coated disc and spill-over cup and a newly designed low partic