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pro vyhledávání: '"Daniel Douriet"'
Autor:
Glen A. Wiedemeier, Lloyd A. Walls, Jose A. Hejase, Francesco Preda, Jean Audet, Daniel Douriet, Dale Becker, Junyan Tang, Sungjun Chun, Megan Nguyen, Daniel M. Dreps
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
A 19.2 Gb/s per lane link with IBM's latest POWER8 processor module has been analyzed. This paper presents the overview of the high-speed link design from the signal integrity point of view. Design approaches in package and printed circuit board (PCB
Publikováno v:
2007 Proceedings 57th Electronic Components and Technology Conference.
This paper discusses crosstalk analysis between interconnects in high-speed server packages. Over the last decade, the scaling of the CMOS transistors has enabled the design of microprocessors operating at multi-gigahertz frequencies. For meeting the
Conference
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