Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Daniel Apone"'
Autor:
Chris Rogers, Sriram Anjur, Mansour Moinpour, Chris E. Barns, Caprice Gray, Vincent P. Manno, Ara Philipossian, Daniel Apone
Publikováno v:
Electrochemical and Solid-State Letters. 8:G109-G111
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ca2365bdf8a5827bab17dd3e34775960
https://doi.org/10.1149/1.1887193
https://doi.org/10.1149/1.1887193
Autor:
Caprice Gray, Sriram Anjur, Mansour Moinpour, Chris E. Barns, Vincent P. Manno, Chris Rogers, Ara Philipossian, Daniel Apone
Publikováno v:
MRS Proceedings. 867
Dual Emission Laser Induced Fluorescence (DELIF) is employed to attempt to experimentally determine the nature of the lubrication regime in Chemical Mechanical Planarization. Our DELIF setup provides images of the polishing slurry between the wafer a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::653df0e09a90d5df64e771124872f185
https://doi.org/10.1557/proc-867-w2.3
https://doi.org/10.1557/proc-867-w2.3
Autor:
Caprice Gray, Vincent P. Manno, Sriram Anjur, Ara Philipossian, Mansour Moinpour, Chris E. Barns, Daniel Apone, Chris Rogers
Publikováno v:
World Tribology Congress III, Volume 2.
Modifications to the Dual Emission Laser Induced Fluorescence (DELIF) procedure used to collect images of the slurry layer between the polishing pad and wafer during Chemical Mechanical Planarization (CMP) have provided a means to attain instantaneou
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e23a32a47090addfe354d45cd96b6897
https://doi.org/10.1115/wtc2005-63805
https://doi.org/10.1115/wtc2005-63805
Autor:
Vincent P. Manno, Chris Rogers, Sriram Anjur, Mansour Moinpour, Chris E. Barns, Ara Philipossian, Daniel Apone, Caprice Gray
Publikováno v:
MRS Proceedings. 867
The interaction of the wafer, slurry and pad determines the material removal rate during Chemical Mechanical Planarization (CMP). Dual emission laser induced fluorescence (DELIF) provides a means to measure the slurry layer thickness between the wafe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::30f97480cd208f42bbc93485cd2ef878
https://doi.org/10.1557/proc-867-w5.4
https://doi.org/10.1557/proc-867-w5.4
Autor:
Chris Rogers, Moinpour Monsour, Sriram Anjur, Caprice Gray, Chris E. Barns, Daniel Apone, Vincent P. Manno
Publikováno v:
MRS Proceedings. 816
Duel Emission Laser Induced Fluorescence (DELIF) and friction measurements are taken in-situ during CMP to observe slurry flow beneath a model of an integrated circuit (IC) wafer. Friction measurements average around 7.5 lb and multiple frequencies a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6b1d5c70550618649b9c5b7031ceaa20
https://doi.org/10.1557/proc-816-k5.4
https://doi.org/10.1557/proc-816-k5.4
Autor:
Li, Yuzhuo
Publikováno v:
Microelectronic Applications of Chemical Mechanical Planarization; 2007, p25-56, 32p
Autor:
Gray, Caprice, Apone, Daniel, Bams, Chris, Monsour, Moinpour, Anjur, Sriram, Manno, Vincent, Rogers, Chris
Publikováno v:
MRS Online Proceedings Library; 2004, Vol. 816 Issue 1, p541-549, 9p
Autor:
Yuzhuo Li
An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) plana
