Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Daniel Aguinaga"'
Autor:
Marco Ojer, Hugo Alvarez, Ismael Serrano, Fátima A. Saiz, Iñigo Barandiaran, Daniel Aguinaga, Leire Querejeta, David Alejandro
Publikováno v:
Applied Sciences, Vol 10, Iss 3, p 796 (2020)
Personalized production is moving the progress of industrial automation forward, and demanding new tools for improving the decision-making of the operators. This paper presents a new, projection-based augmented reality system for assisting operators
Externí odkaz:
https://doaj.org/article/af5e831952f54c879e170a5a143a5b4f
Autor:
Ander Garcia, Arantza Del Pozo, Mikel Arrieta, Jaime Osacar, Mikel De la Cruz, Daniel Aguinaga
Publikováno v:
Memorias de la Vigésima Primera Conferencia Iberoamericana en Sistemas, Cibernética e Informática: CISCI 2022.
Autor:
Luis Matey-Muñoz, María Isabel Rodríguez-Ferradas, Unai Etxaniz-Sein, Hector Morcillo-Fuentes, Chuan Cao, Aitor Cazón-Martín, Paz Morer-Camo, Daniel Aguinaga-Azpiazu
Publikováno v:
Rapid Prototyping Journal. 26:349-359
Purpose The purpose of this study is to explore a methodology for connecting microelectromechanical system sensors – i.e. inertial measurement unit (IMU) – to an Arduino-based microcontroller, using graphene-based conductive filament and flexible
Autor:
Leire Querejeta, Daniel Aguinaga, Ismael Serrano, David Alejandro, Iñigo Barandiaran, Hugo Álvarez, Fátima A. Saiz, Marco Ojer
Publikováno v:
Applied Sciences, Vol 10, Iss 3, p 796 (2020)
Applied Sciences
Volume 10
Issue 3
Applied Sciences
Volume 10
Issue 3
Personalized production is moving the progress of industrial automation forward, and demanding new tools for improving the decision-making of the operators. This paper presents a new, projection-based augmented reality system for assisting operators
Autor:
Marc Feron, Vladimir Cherman, Barbara Bonnet, Daniel Aguinaga, Mario Gonzalez, Ignas van Dommelen
Publikováno v:
2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).
Sencio has been involved in an EU-funding H2020 project called PAMPA that was finalized last year. The goal of the project was to develop a plastic QFN-packaging solution for RF-components for Space application (Satellites). Today hermetic sealed cer