Výsledky vyhledávání - "Daniel A. Delibac"

Using a Barrier Layer to Inhibit Ti/Oxide Reaction to Reduce RC Delay and Improve Electromigration in Al-Cu/Ti/W Interconnect for High Power Analog and Mixed Signal Applications

Autor: William J. Murphy, Daniel S. Vanslette, Stephen E. Luce, Stephen A. Mongeon, Tom C. Lee, Daniel A. Delibac, David C. Thomas, Timothy D. Sullivan, Z.X. He, Jonathan D. Chapple-Sokol

Publikováno v: MRS Proceedings. 1079

In this paper, we report a novel method to improve aluminum interconnect electromigration performance, reduce metal line sheet resistance (Rs) and reduce via contact resistance (Rc) in a minimum pitch design. We report the effects of bottom redundanc

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::d2a09642561d03146cbcb65d60ea3a8d
https://doi.org/10.1557/proc-1079-n09-01

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