Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Danial Huang"'
Publikováno v:
2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
IC backend chip scale package Re-Distribution Layer (RDL) routing space is getting smaller and pattern density is getting higher while device technology has been scaling down continuously. However, smaller routing space will induce higher leakage cur
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cc785fd2dbea3e4d16945f7c2fd44c94
https://doi.org/10.1109/asmc.2016.7491095
https://doi.org/10.1109/asmc.2016.7491095
Autor:
Jessica Chiu, Chienfan Chen, Danial Huang, JW Lou, MaggieMC Liu, Junior Lin, Chin-Li Kao, John Hunt
Publikováno v:
3rd Electronics System Integration Technology Conference ESTC.
Over ten years ago, Wafer Level Chip Scale Packaging (WLCSP) began with very small packages having solderball counts of 2–6 I/O. Over the years, the I/O count has grown, but the industry perception has always been that WLCSPs are limited to low I/O
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fa758b3af6d3e7507e9d11332330544d
https://doi.org/10.1109/estc.2010.5642883
https://doi.org/10.1109/estc.2010.5642883
Autor:
Homing Tong, Ker-Chang Hsieh, Simon Su, Tom Tai, Adren Hsieh, Jui-I Yu, Rick Yu, Walter Jau, Danial Huang
Publikováno v:
2006 International Microsystems, Package, Assembly Conference Taiwan.
Wafer bumping is growing in importance with the increasing used of Flip Chip package. In this study, we tried to determine which factors at photosensitive film lithography process had an effect on photosensitive film sidewall profile. The analysis of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b999c1e768858c582634099b587b2c2e
https://doi.org/10.1109/impact.2006.312207
https://doi.org/10.1109/impact.2006.312207