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Autor:
Tim Pasang, Pai-Chen Lin, Wojciech Z. Misiolek, Jia-Yuan Wei, Shinichiro Masuno, Masahiro Tsukamoto, Eiji Hori, Yuji Sato, Yuan Tao, Danang Yudhistiro, Salahuddin Yunus
Publikováno v:
Quantum Beam Science, Vol 6, Iss 3, p 24 (2022)
The need for thin foil welding is increasing significantly, particularly in the electronic industries. The technologies that are currently available limit the joining processes in terms of materials and their geometries. In this paper, a series of tr
Externí odkaz:
https://doaj.org/article/db36e5faeff94bd699fd87e46ab49724