Zobrazeno 1 - 10
of 11
pro vyhledávání: '"Dana Dereus"'
Publikováno v:
Journal of Microelectromechanical Systems. 25:737-743
Dielectric charging is one of the key topics concerning microelectromechanical capacitive switch reliability; however, very little is known about how charge is generated on an exposed dielectric surface when brought in contact with another dielectric
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1677984c2b670f71b4e4612222a6e14d
https://doi.org/10.1109/jmems.2016.2573742
https://doi.org/10.1109/jmems.2016.2573742
Publikováno v:
2014 IEEE International Reliability Physics Symposium.
A dielectric charging characterization is presented based on simple MEMS structures with insulator-insulator contact. Surface charging is generated by triboelectric effects when the MEMS switch is actuated and both insulators are in contact. Hold-dow
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::abafed5afaf436ecc2575a313b593f04
https://doi.org/10.1109/irps.2014.6860668
https://doi.org/10.1109/irps.2014.6860668
Publikováno v:
2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS).
The purpose of this paper is to present results of our dynamic characterization of tunable RF MEMS capacitor products that will provide tunable RF solutions for wireless communications. We will present measurement and simulation results for switching
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ebf86671e572de96d20e72193fe789fc
https://doi.org/10.1109/memsys.2014.6765876
https://doi.org/10.1109/memsys.2014.6765876
Autor:
Zheng Zhang, Dana Dereus, Shawn J. Cunningham, J. McKillop, G. Lorenz, Mattan Kamon, Art Morris, Luca Daniel, S. Maity, S. Kim
Publikováno v:
2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII).
In this paper we present a new hybrid finite-element/component-modeling approach that can predict the pull-in and release behavior of MEMS switches orders of magnitude faster, and with significantly more behavioral detail, than traditional finite-ele
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::82a8d2f0b501e22465a007229b38e05c
https://doi.org/10.1109/transducers.2013.6627283
https://doi.org/10.1109/transducers.2013.6627283
Autor:
I. Vitomirov, M.D. Gordon, Dana Dereus, Shawn J. Cunningham, Z.-X. He, N. Lai, Eric J. White, Jeffrey C. Maling, William J. Murphy, C. Gillman, S.L. Luce, B.K. Wong, Art Morris, A. K. Stamper, Christopher V. Jahnes
Publikováno v:
2012 Solid-State, Actuators, and Microsystems Workshop Technical Digest.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::39f65663a9c8962c44431278159c1eb5
https://doi.org/10.31438/trf.hh2012.30
https://doi.org/10.31438/trf.hh2012.30
Autor:
Eric J. White, Russell T. Herrin, Christopher V. Jahnes, I. Vitomirov, Z.X. He, Dana Dereus, D. R. Miga, S. E. Luce, Shawn J. Cunningham, Art Morris, William J. Murphy, S. R. Dupuis, Jeffrey C. Maling, A. Gupta, A.K. Stamper
Publikováno v:
2011 16th International Solid-State Sensors, Actuators and Microsystems Conference.
MEMS capacitor switches have been integrated with high voltage CMOS ICs. The MEMS were formed with the final three AlCu wiring levels in SiO 2 using a planar sacrificial silicon cavity process. The MEMS cavities were hermetically sealed at less than
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::80e9e215e72d470be66b4789fd5467b7
https://doi.org/10.1109/transducers.2011.5969479
https://doi.org/10.1109/transducers.2011.5969479
Publikováno v:
2011 IEEE 24th International Conference on Micro Electro Mechanical Systems.
This paper describes the design of a novel tunable RF-MEMS capacitor that is fabricated in a 0.18 µm monolithically integrated RF-MEMS, 50 V LDMOS, 5 V CMOS technology. The novelty of the designs begins with the ability to use a single design for se
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::33ac44cc72fa7f6091816bb7376c568c
https://doi.org/10.1109/memsys.2011.5734547
https://doi.org/10.1109/memsys.2011.5734547
Publikováno v:
2011 IEEE 11th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems.
A zero-level packaged, digitally switched, RF MEMS capacitor array has been developed within a mass production capable HV RF CMOS process. These RF MEMS capacitors are grouped in flip-chip cells that exhibit a high quality factor of 87 at 2 GHz, a tu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8e786d75adf96a1cf4d2efa8649667c4
https://doi.org/10.1109/sirf.2011.5719327
https://doi.org/10.1109/sirf.2011.5719327
Publikováno v:
Volume 5: Electronics and Photonics.
Board-level and package-level drop reliability is of critical importance for RF MEMS packages. In this paper, we present a numerical study of reliability of RF MEMS packages during board-level and package-level drop testing. The RF MEMS package consi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fe40a0f67903103c854dab89d08bb767
https://doi.org/10.1115/imece2009-11741
https://doi.org/10.1115/imece2009-11741
Publikováno v:
Morris, Arthur S. ; Cunningham, Shawn ; Dereus, Dana ; Schröpfer, Gerold (2003) High-Performance Integrated RF-MEMS: Part 1-The Process. In: Gallium Arsenide applications symposium. GAAS 2003, 6-10 October 2003, Munich.
RF MEMS have been pursued for more than a decade as a solution to high-performance on-chip fixed, tunable and switchable passives. However, the implementation of RF-MEMS into products has remained elusive. This is partly due to special-purpose proces
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d2ff57d42b3b961187a8f535630759ea
