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Autor:
Mark Doherty, Dan Vanslette, Anthony K. Stamper, Wayne H. Woods, Mete Erturk, Mike McPartlin, Alvin J. Joseph, Cheun-Wen Huang, James E. Dunn
Publikováno v:
Ultra-thin Chip Technology and Applications ISBN: 9781441972750
This chapter focuses on some of the radiofrequency (RF) and millimetre-wave (MMW) applications that a through-silicon via (TSV) technology can enable. We will first discuss a grounded TSV application for a RF wireless communication power amplifier th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a45319bd7732eda0abf47d06cf57d752
https://doi.org/10.1007/978-1-4419-7276-7_34
https://doi.org/10.1007/978-1-4419-7276-7_34