Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Dan Scherrer"'
Autor:
Xuejun Lu, Xing Lan, Rich Lai, Evan Nguyen, Maggie Yihong Chen, Jesse Tice, Thomas Chung, Dan Scherrer
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 7:1369-1376
We demonstrate a new, low-cost, additive aerosol jet (AJ) printing fabrication method for 3-D on-chip interconnects on III–V semiconductor chips. A dielectric layer and bridge-type gold interconnects were printed on a GaAs-based microwave monolithi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b0a4b3f698c3121072f7b7774c0bf57e
https://doi.org/10.1109/tcpmt.2017.2710957
https://doi.org/10.1109/tcpmt.2017.2710957
Autor:
Leland Gilreath, Andrew D. Smith, Tim LaRocca, Charlie Jackson, Ashley Danial, Khanh Thai, Minh Thai, Yi-Cheng Wu, Dan Scherrer, Monte Watanabe, Naveen Daftari
Publikováno v:
2015 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS).
The first reported reconfigurable wideband mm-wave CMOS based beam forming network IC is demonstrated. The IC consists of two independent inputs and two correlated outputs. Each of the four RF paths has 2 bits amplitude control and 3 bits phase contr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3b7b00516a658f71cf4c5612e982b3d5
https://doi.org/10.1109/csics.2015.7314485
https://doi.org/10.1109/csics.2015.7314485
Autor:
Ralph A. Schweinfurth, Douglas W. Barlage, D. J. Van Harlingen, C. E. Platt, Milton Feng, Dan Scherrer, J. Kruse, F. Gao
Publikováno v:
SPIE Proceedings.
make s-parameter measurements of passive coplanar circuits as well as to characterize the performance of GaAsMESFETs at 80K. Comparisons were made between measured data and theoretical results for passive YBCO andAluminum structures. The YBCO film wa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fba0afd8c509eda4f03034d3feee9f97
https://doi.org/10.1117/12.166152
https://doi.org/10.1117/12.166152