Zobrazeno 1 - 10
of 17
pro vyhledávání: '"Dan Bodoh"'
Autor:
Kristofor Dickson, George Lange, Keith Serrels, Jose Garcia, Kent Erington, Dan Bodoh, Kee Yang, Jianxun Mou
Publikováno v:
International Symposium for Testing and Failure Analysis.
Laser Voltage Probing (LVP) is an essential Failure Analysis (FA) technique that has been widely adopted by the industry. Waveforms that are collected allow for the analyst to understand various internal failure modes related to timing or abnormal ci
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6f45e8f3771241eba2b990fb94799bc4
https://doi.org/10.31399/asm.cp.istfa2022p0144
https://doi.org/10.31399/asm.cp.istfa2022p0144
Autor:
Dan Bodoh, Kent Erington
Publikováno v:
International Symposium for Testing and Failure Analysis.
This presentation is an application-oriented tutorial on laser-assisted device alteration (LADA) and soft defect localization (SDL) techniques and how they are used to analyze marginal digital failures and identify analog circuits that are sensitive
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::00c84d8a3dfa0cb8f974f2f36c6bd657
https://doi.org/10.31399/asm.cp.istfa2022tpc1
https://doi.org/10.31399/asm.cp.istfa2022tpc1
Autor:
Dan Bodoh, Kent Erington
This presentation is an application oriented tutorial on laser-assisted device alteration (LADA) and soft defect localization (SDL) techniques and how they are used to analyze marginal digital failures and identify analog circuits that are sensitive
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::4ca1d0a6d9be2f8537cf2d14d31ff399
https://doi.org/10.31399/asm.tb.mfadr7.t91110228
https://doi.org/10.31399/asm.tb.mfadr7.t91110228
Publikováno v:
International Symposium for Testing and Failure Analysis.
We present the first experimental demonstration of stuck-at scan chain fault isolation through the exploitation of Single Event Upsets (SEU) in a Laser-Induced Fault Analysis (LIFA) system. By observing a pass/fail flag, we can spatially map all flop
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5c26a468bf77848ab19aa764096c5a53
https://doi.org/10.31399/asm.cp.istfa2018p0093
https://doi.org/10.31399/asm.cp.istfa2018p0093
Autor:
Dan Bodoh, Kent Erington
Publikováno v:
EDFA Technical Articles. 17:10-17
Laser-assisted device alteration (LADA) is an effective tool for identifying speed-limiting paths in ICs. When implemented with a continuous wave laser, it can reveal where the speed-limiting path resides but not when the slow (or fast) logic transit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1e33c830ae016bf00f6eb1eb4d8f2bd0
https://doi.org/10.31399/asm.edfa.2015-2.p010
https://doi.org/10.31399/asm.edfa.2015-2.p010
Autor:
Dan Bodoh
Publikováno v:
EDFA Technical Articles. 17:24-27
The 40th International Symposium for Testing and Failure Analysis (ISTFA 2014) was held November 8 to 14, 2014, at the George R. Brown Convention Center in Houston, Texas. “Exploring the Many Facets of Failure Analysis,” the theme of ISTFA 2014,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d2924b6aa6a8bf9c81dcf9dc38413c6b
https://doi.org/10.31399/asm.edfa.2015-1.p024
https://doi.org/10.31399/asm.edfa.2015-1.p024
Publikováno v:
International Symposium for Testing and Failure Analysis.
We present an upgraded time-resolved LADA system, with a 25ps pulsed laser, integrated into a commercial laser scanning microscope used in failure analysis. We demonstrate the use of this system on 14nm/16nm finfet devices.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d1a4d4f4f6f2e99116fbdc25984b1e51
https://doi.org/10.31399/asm.cp.istfa2017p0228
https://doi.org/10.31399/asm.cp.istfa2017p0228
Autor:
T. Crawford, C. Farrell, Christophe Dorrer, Marius Rutkauskas, Kenneth L. Marshall, T. R. Lundquist, Praveen Vedagarbha, Dan Bodoh, Kent Erington, Derryck T. Reid
Publikováno v:
Conference on Lasers and Electro-Optics.
The rapidly developing semiconductor industry demands constant innovations in optoelectronic imaging of semiconductor integrated circuits to keep up with continuing device scaling. It was recently shown that two-photon laser-assisted device alteratio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::2cca5c2ef82108358259038947acb768
https://doi.org/10.1364/cleo_at.2016.atu3j.8
https://doi.org/10.1364/cleo_at.2016.atu3j.8
Publikováno v:
International Symposium for Testing and Failure Analysis.
Laser-assisted device alteration (LADA) is an established technique used to identify critical speed paths in integrated circuits. LADA can reveal the physical location of a speed path, but not the timing of the speed path. This paper describes the ro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cdbbfddd52191e3bcb2d7012f0f1aaec
https://doi.org/10.31399/asm.cp.istfa2014p0082
https://doi.org/10.31399/asm.cp.istfa2014p0082
Publikováno v:
International Symposium for Testing and Failure Analysis.
Laser-assisted device alteration (LADA) is an established technique used to identify critical speed paths in integrated circuit. In this paper, the characterization of continuous wave 1340nm laser induced currents and the LADA failure rate show that
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dfad589277e6663aa9224d8c580907b9
https://doi.org/10.31399/asm.cp.istfa2014p0073
https://doi.org/10.31399/asm.cp.istfa2014p0073