Zobrazeno 1 - 10
of 24
pro vyhledávání: '"Dan Amey"'
Publikováno v:
Ceramic Interconnect Technology Handbook ISBN: 9781315221281
Modern ceramic substrates and packages are sophisticated combinations of glasses, ceramics, and metals that can form compact cost-effective solutions for a variety of applications. Ceramic materials have a long successful history of application in th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5be567d5cfa67ce0b319c4e45e1ec1d9
https://doi.org/10.1201/9781315221281-1
https://doi.org/10.1201/9781315221281-1
Publikováno v:
2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference.
New applications such as the use of High Brightness Light Emitting Diodes (HB-LED's) for general lighting have brought about significant demand for thin dielectric materials laminated to metal substrates such as aluminum and copper. Conventional FR-4
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b3356454a924a97d8072f4faa35e9ad4
https://doi.org/10.1109/impact.2010.5699663
https://doi.org/10.1109/impact.2010.5699663
Conference
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Publikováno v:
2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No.02CH37278); 2002, p1617-1620, 4p
Publikováno v:
2001 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems. Digest of Papers (IEEE Cat. No.01EX496); 2001, p210-214, 5p
Autor:
Rector, J.
Publikováno v:
1998 Proceedings 48th Electronic Components & Technology Conference (Cat No98CH36206); 1998, p218-224, 7p
Publikováno v:
Computer (00189162); 1982, Vol. 15 Issue 5, p137-149, 13p
Publikováno v:
Computer (00189162); 1979, Vol. 12 Issue 12, p148-152, 5p