Zobrazeno 1 - 1
of 1
pro vyhledávání: '"Damian Freimund"'
Autor:
Steve Voges, Martin Schneider-Ramelow, Tanja Braun, Robert Gernhardt, Damian Freimund, Dirk Schwantuschke, Sven Engels, Thanh Duy Nguyen, Karl-Friedrich Becker, Markus Wohrmann, Michael Pretl, Klaus-Dieter Lang, Ivan Ndip, Erdin Ture
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Driven by 5G or radar applications there is an increasing market for GaN device for RF power applications. GaN component packaging is done today mainly by wire bonding in combination with expensive ceramic based packaging solutions. Cost efficient Fa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::38dbdcd6512fad7a4d2aea2045901687
https://doi.org/10.1109/ectc32862.2020.00014
https://doi.org/10.1109/ectc32862.2020.00014
