Zobrazeno 1 - 10
of 37
pro vyhledávání: '"Damena Agonafer"'
Autor:
Daeyoung Kong, Yunseo Kim, Minsoo Kang, Erdong Song, Yongtaek Hong, Han Sang Kim, Kyupaeck Jeff Rah, Hyoung Gil Choi, Damena Agonafer, Hyoungsoon Lee
Publikováno v:
Case Studies in Thermal Engineering, Vol 28, Iss , Pp 101583- (2021)
Manifold microchannel heat sinks (MMCHSs) have attracted attention for the thermal management of high-performance electronics owing to their high heat dissipation rate and low pressure drop compared to conventional microchannels. This study used a fu
Externí odkaz:
https://doaj.org/article/0dd9e38173834607b8a89d5edcc9d99a
Publikováno v:
Journal of Electronic Packaging. 145
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::30cbe3f5afec023dc9f59b20f3b3951f
https://doi.org/10.1115/1.4056558
https://doi.org/10.1115/1.4056558
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:1583-1591
High-vapor-quality flow boiling on structured surfaces has the potential to enhance heat transfer performance and reduce temperature/pressure instability compared to conventional lower quality flow boiling on smooth surfaces. In this article, we disc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f1f89a939398825d0961c689cc41204a
https://doi.org/10.1109/tcpmt.2021.3085255
https://doi.org/10.1109/tcpmt.2021.3085255
Autor:
Daeyoung Kong, Euibeen Jung, Yunseo Kim, Vivek Vardhan Manepalli, Kyupaeck Jeff Rah, Han Sang Kim, Yongtaek Hong, Hyoung Gil Choi, Damena Agonafer, Hyoungsoon Lee
Publikováno v:
International Journal of Mechanical Sciences. 248:108228
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5e5be38e4303cad88028f2f920a86829
https://doi.org/10.1016/j.ijmecsci.2023.108228
https://doi.org/10.1016/j.ijmecsci.2023.108228
Autor:
Yunseo Kim, Min-Soo Kang, Yongtaek Hong, Hyoungsoon Lee, Damena Agonafer, Daeyoung Kong, Hyoung Gil Choi, Kyupaeck Jeff Rah, Erdong Song, Han Sang Kim
Publikováno v:
Case Studies in Thermal Engineering, Vol 28, Iss, Pp 101583-(2021)
Manifold microchannel heat sinks (MMCHSs) have attracted attention for the thermal management of high-performance electronics owing to their high heat dissipation rate and low pressure drop compared to conventional microchannels. This study used a fu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::78c829581fc26334a75bdf9ebc2edc2a
http://www.sciencedirect.com/science/article/pii/S2214157X21007462
http://www.sciencedirect.com/science/article/pii/S2214157X21007462
Publikováno v:
Journal of Electronic Packaging. 143
Over the last several decades, cooling technologies have been developed to address the growing thermal challenges associated with high-powered electronics. However, within the next several years, the heat generated by these devices is predicted to ex
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::08d215ec909633ff5271cb940a1f1ce8
https://doi.org/10.1115/1.4052465
https://doi.org/10.1115/1.4052465
Publikováno v:
International Journal of Heat and Mass Transfer. 141:191-203
In scaling computer performance, closely integrating heterogeneous components in a single system-in-package assembly provides faster signal communication and a tighter footprint – but also generates more heat: state-of-the-art microelectronic devic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3e170198ba7aa815a7e515e8914beeb6
https://doi.org/10.1016/j.ijheatmasstransfer.2019.06.042
https://doi.org/10.1016/j.ijheatmasstransfer.2019.06.042
Publikováno v:
Langmuir. 35:12264-12275
The design of topological features to control the spreading of liquid has been widely investigated. Micropillar structures, for example, can retain stable droplets on the tip by inhibiting the contact line from advancing over a sharp solid edge. The
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::4ad99884976c240b5c4a6cd306812314
https://doi.org/10.1021/acs.langmuir.9b01410
https://doi.org/10.1021/acs.langmuir.9b01410
Publikováno v:
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
This work aims to mitigate the overdesign of steady state packaging systems by combining an organic phase change material (o-PCM) and a metallic PCM (m-PCM) to create a passive cooling composite for pulse power applications. The organic constituent,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5268f3ebd18bc48727ab60a23b11238f
https://doi.org/10.1109/itherm45881.2020.9190502
https://doi.org/10.1109/itherm45881.2020.9190502
Publikováno v:
Applied Thermal Engineering. 195:117142
Two-phase liquid cooling on nanoengineered surfaces has shown great promise for tackling overheating in high performance microelectronics. At the nanoscale, phase change heat transfer can be affected substantially by the thermal resistance at the sol
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2ac5fb3955342f79a627ea794aa2cedd
https://doi.org/10.1016/j.applthermaleng.2021.117142
https://doi.org/10.1016/j.applthermaleng.2021.117142