Zobrazeno 1 - 10
of 21
pro vyhledávání: '"Dale W. Swanson"'
Autor:
Leonard R. Enlow, Dale W. Swanson
Publikováno v:
Microelectronics Reliability. 41:499-510
Conventional, high Tg adhesives can result in cracking of magnetics (transformers and inductors) and ceramic substrates after cure or after thermal cycling and extended stress screens. Cracking in substrates may result in electrical “opens” in un
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e343e68222b883d16539b45bf6b69a73
https://doi.org/10.1016/s0026-2714(00)00263-8
https://doi.org/10.1016/s0026-2714(00)00263-8
Publikováno v:
Microelectronics Reliability. 39:515-527
Plastic-encapsulated microcircuits (PEMs) are proposed for use in military systems to reduce cost and eliminate long-lead items such as packages and lids. Encapsulant materials must be evaluated for compatibility with devices and fine-wire bonds, and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fa8b95bb844bf399cceaa106480e843f
https://doi.org/10.1016/s0026-2714(98)00202-9
https://doi.org/10.1016/s0026-2714(98)00202-9
Autor:
James J. Licari, Dale W. Swanson
Publisher Summary This chapter discusses general and specific applications of polymer adhesives which include die attachment, surface mounting, medical, automotive, military, space, optoelectronics, and ?atpanel displays. Surface-mount technology (SM
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3dc28d73d699fc9289b01281e92f0b8b
https://doi.org/10.1016/b978-1-4377-7889-2.10005-1
https://doi.org/10.1016/b978-1-4377-7889-2.10005-1
Autor:
James J. Licari, Dale W. Swanson
Publisher Summary This chapter discusses the reliability of an adhesive and its impact on the performance of an electronic assembly. The major failure modes of adhesives include loss of adhesion, high thermal impedance, loss of electrical contact, an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c4902f641469c4f230ebfd32adbbb2fc
https://doi.org/10.1016/b978-1-4377-7889-2.10006-3
https://doi.org/10.1016/b978-1-4377-7889-2.10006-3
Autor:
James J. Licari, Dale W. Swanson
Publisher Summary This chapter discusses various aspects of chemistry, formulation, and properties of adhesives. Epoxy adhesives are the most widely used and most versatile of the polymer types and they combine numerous desirable properties including
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::2cac37e50d16aa9a9e3c39e598c94342
https://doi.org/10.1016/b978-1-4377-7889-2.10003-8
https://doi.org/10.1016/b978-1-4377-7889-2.10003-8
Autor:
Dale W. Swanson, James J. Licari
This chapter covers in detail the four main functions of adhesives used in the assembly of electronic devices and circuits. These are: mechanical attachment, electrical connections, thermal dissipation, and stress relief. Various theories and mechani
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a67672adb81af8eb1f337cabd6e4abce
https://doi.org/10.1016/b978-1-4377-7889-2.10002-6
https://doi.org/10.1016/b978-1-4377-7889-2.10002-6
Autor:
Dale W. Swanson, James J. Licari
Publisher Summary This chapter discusses the test methods closely related to adhesives for die and substrate attachment, surface-mounting of components, under?ll, and optoelectronic assembly. Physical-property tests are used to measure the properties
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b5d43c56aa359bce503f1f85666857e0
https://doi.org/10.1016/b978-1-4377-7889-2.10007-5
https://doi.org/10.1016/b978-1-4377-7889-2.10007-5