Zobrazeno 1 - 10
of 14
pro vyhledávání: '"Daisuke Mizoguchi"'
Publikováno v:
IEICE Transactions on Electronics. :200-205
A wireless transceiver utilizing inductive coupling has been proposed for communication between chips in system in a package. This transceiver can achieve high-speed communication by using two-dimensional channel arrays. To increase the total bandwid
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1fc77b57438694835bfe40ecaa2b329b
https://doi.org/10.1093/ietele/e91-c.2.200
https://doi.org/10.1093/ietele/e91-c.2.200
Autor:
Yoshihiro Nakagawa, Mari Inoue, Kiichi Niitsu, Daisuke Mizoguchi, Noriyuki Miura, Muneo Fukaishi, Takayasu Sakurai, Tadahiro Kuroda, Masamoto Tago
Publikováno v:
IEEE Journal of Solid-State Circuits. 42:111-122
A 1 Tb/s 3 W inter-chip transceiver transmits clock and data by inductive coupling at a clock rate of 1 GHz and data rate of 1 Gb/s per channel. 1024 data transceivers are arranged with a pitch of 30 mum in a layout area of 1 mm2. The total layout ar
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4c3428c7bd192e352fdbdfb69ec42f1c
https://doi.org/10.1109/jssc.2006.886554
https://doi.org/10.1109/jssc.2006.886554
Publikováno v:
Japanese Journal of Applied Physics. 45:3286-3289
An inductive inter-chip wireless communication scheme in three-dimensional (3D) stacked chip has been reported to achieve high-speed, low-power, and low-cost inter-chip communication. In this scheme, inductive coupling becomes a fundamental of commun
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::4cedade9baf5084f55a80b1f1908b09d
https://doi.org/10.1143/jjap.45.3286
https://doi.org/10.1143/jjap.45.3286
Publikováno v:
IEICE Transactions on Electronics. :320-326
A wireless interface for stacked chips in System-in-a-Package is presented. The interface utilizes inductive coupling between metal inductors. S21 parameters of the inductive coupling are measured between chips stacked in face-up for the first time.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::38caac987f277d747f9c30d03e477772
https://doi.org/10.1093/ietele/e89-c.3.320
https://doi.org/10.1093/ietele/e89-c.3.320
Publikováno v:
IEEE Journal of Solid-State Circuits. 41:23-34
A wireless interface by inductive coupling achieves aggregated data rate of 195 Gb/s with power dissipation of 1.2W among 4-stacked chips in a package where 195 transceivers with the data rate of 1 Gb/s/channel are arranged in 50-/spl mu/m pitch in 0
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::110cd99f6ab11bbef880e7e76abca7cb
https://doi.org/10.1109/jssc.2005.858625
https://doi.org/10.1109/jssc.2005.858625
Publikováno v:
IEEE Journal of Solid-State Circuits. 40:829-837
A wireless bus for stacked chips was developed by utilizing inductive coupling among them. This paper discusses inductor layout optimization and transceiver circuit design. The inductive coupling is analyzed by a simple equivalent circuit model, para
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aede4a013d76bb8c2b5790797d0253e6
https://doi.org/10.1109/jssc.2005.845560
https://doi.org/10.1109/jssc.2005.845560
Publikováno v:
ISSCC. 2005 IEEE International Digest of Technical Papers. Solid-State Circuits Conference, 2005..
An inductively coupled wireless interface achieves aggregated data rate of 195Gbit/s among 4 stacked chips in a package by arranging 195 transceivers in 50/spl mu/m pitch with power dissipation of 1.2W. The transmit power is controlled in accordance
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9df031463479a6a7e9d36b15ca5956f7
https://doi.org/10.1109/isscc.2005.1493970
https://doi.org/10.1109/isscc.2005.1493970
Publikováno v:
2005 International Conference on Integrated Circuit Design and Technology, 2005. ICICDT 2005..
Recently, a 3-dimensional integrated circuits (3D-ICs) are appeared for high density packaging. High speed interconnection is expected in 3D-ICs. A wireless bus for stacked chips is presented in this paper. The interface utilizes inductive coupling w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e6073877402f81a9e7e351583d58ca6d
https://doi.org/10.1109/icicdt.2005.1502591
https://doi.org/10.1109/icicdt.2005.1502591
Publikováno v:
CICC
Inductive coupling among stacked chips in a package enables 1.2 Gb/s/channel data communications. An array arrangement of the channel increases data bandwidth, while the signal may be degraded by cross talk. In this paper, cross talk is measured and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ca72921064caf1bacdcb1234b4f2f416
https://doi.org/10.1109/cicc.2004.1358746
https://doi.org/10.1109/cicc.2004.1358746
Autor:
Yoshihiko Tano, Daisuke Mizoguchi, Takehiko Kobayashi, Toshiharu Matsushima, Rinzo Soejima, Hiroaki Naoe
Publikováno v:
Haigan. 19:37-47
昭和50年から52年の3年間に, 7名の肺炎様陰影を呈する肺癌患者が, 川崎医科大学呼吸器内科へ入院した.多くは徴熱, 咳噺があり, 肺炎, 肺結核などと診断されていた.その胸部X線像は, 均等
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eab36b0b29c9808fd8e37e86b0b1025f
https://doi.org/10.2482/haigan.19.37
https://doi.org/10.2482/haigan.19.37