Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Daiki Furuyama"'
Publikováno v:
Journal of Smart Processing. 11:227-232
Publikováno v:
IMAPSource Proceedings. 2022
The various kinds of the packaging technologies such as 2.nD, 2.5D, 3D are highly studied with the rapid development of miniaturization and high density of semiconductor packaging. This trend increases the importance of fine pitch interconnect. To ac
Effect of Cu Addition and Annealing on Electrodeposited Bi-Te Films for Micro Thermoelectric Devices
Autor:
Misaki Sugie, Daiki Furuyama, Mikiko Saito, Yoshiaki Sonobe, Hidefumi Takahashi, Ichiro Terasaki, Takayuki Homma
Publikováno v:
ECS Meeting Abstracts. :2197-2197
Micro thermoelectric devices can directly convert heat energy into electric energy even with small heat source [1]. To prepare thermoelectric materials for the micro devices, electrodeposition have numbers of advantages, for example patterned formati
Publikováno v:
ECS Meeting Abstracts. :4079-4079
Among various fields where ZnO is applied, thermoelectric application has received considerable attraction because metal oxide materials have high thermal stability. Up to date, various methods to prepare ZnO have been studied. Among them, electroche