Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Daiki Furuyama"'
Publikováno v:
Journal of Smart Processing. 11:227-232
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7d79b5eee76c813626760674ee6f5672
https://doi.org/10.7791/jspmee.11.227
https://doi.org/10.7791/jspmee.11.227
Publikováno v:
IMAPSource Proceedings. 2022
The various kinds of the packaging technologies such as 2.nD, 2.5D, 3D are highly studied with the rapid development of miniaturization and high density of semiconductor packaging. This trend increases the importance of fine pitch interconnect. To ac
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::853e65282393bb5c74c84b2e2ee689eb
https://doi.org/10.4071/001c.74592
https://doi.org/10.4071/001c.74592
Effect of Cu Addition and Annealing on Electrodeposited Bi-Te Films for Micro Thermoelectric Devices
Autor:
Misaki Sugie, Daiki Furuyama, Mikiko Saito, Yoshiaki Sonobe, Hidefumi Takahashi, Ichiro Terasaki, Takayuki Homma
Publikováno v:
ECS Meeting Abstracts. :2197-2197
Micro thermoelectric devices can directly convert heat energy into electric energy even with small heat source [1]. To prepare thermoelectric materials for the micro devices, electrodeposition have numbers of advantages, for example patterned formati
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::833356babcc61593df909c55e5d39380
https://doi.org/10.1149/ma2017-02/52/2197
https://doi.org/10.1149/ma2017-02/52/2197
Publikováno v:
ECS Meeting Abstracts. :4079-4079
Among various fields where ZnO is applied, thermoelectric application has received considerable attraction because metal oxide materials have high thermal stability. Up to date, various methods to prepare ZnO have been studied. Among them, electroche
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e551244fcfffeaef8700de899a2e38ee
https://doi.org/10.1149/ma2016-02/53/4079
https://doi.org/10.1149/ma2016-02/53/4079
Publikováno v:
Advancing Microelectronics; Jul/Aug2022, Vol. 49 Issue 4, p26-27, 2p