Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Daichi Okamoto"'
Autor:
Pulugurtha Markondeya Raj, Rao Tummala, Madhavan Swaminathan, Takenori Kakutani, Daichi Okamoto, Shreya Dwarakanath
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:1552-1559
Downscaling of package wiring has been the singular focus to achieve higher logic-memory interconnect density to meet next-generation needs for high-bandwidth computing. This article presents, for the first time, a systematic modeling and experimenta
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ee7bda0790c9c974a350489c3be94aab
https://doi.org/10.1109/tcpmt.2020.3013197
https://doi.org/10.1109/tcpmt.2020.3013197
Autor:
Muhammad Ali, Manos M. Tentzeris, Atom Watanabe, Rao Tummala, Markondeya Raj Pulugurtha, Tong-Hong Lin, Daichi Okamoto
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:1515-1523
Package-integrated and ultrathin power dividers with footprint smaller than unit $\lambda ~_{0}~^{\mathrm{ 2}}$ at the operating frequency of 28-GHz 5G new radio (NR) n257 and n258 bands are presented for the first time for small-cell applications. T
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::974506f40017bdc8a5f1e9170299221d
https://doi.org/10.1109/tcpmt.2020.3013725
https://doi.org/10.1109/tcpmt.2020.3013725
Publikováno v:
International Symposium on Microelectronics. 2020:000307-000312
In this paper, we reveal the development of a novel two-layer Solder Resist (SR) film with low young’s modulus which consists of low young’s modulus layer that possesses excellent adhesion to substrate and thermal resistance layer which is compos
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6b1a82e9b09d7f545775c422873ef964
https://doi.org/10.4071/2380-4505-2020.1.000307
https://doi.org/10.4071/2380-4505-2020.1.000307
Autor:
Muhammad Ali, Daichi Okamoto, Zhong Guan, Atom Watanabe, Yuya Suzuki, Madhavan Swaminathan, Takenori Kakutani, Mohanalingam Kathaperumal
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
In this paper, we report an advanced low-loss dry film build-up material applicable to high-frequency transmission, and evaluation of filter characteristics and dielectric characteristics in the mmWave band. The wireless communication standard is evo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::62a20619a38a288d23f95d6304993a0e
https://doi.org/10.1109/ectc32862.2020.00108
https://doi.org/10.1109/ectc32862.2020.00108
Publikováno v:
International Symposium on Microelectronics. 2018:000466-000469
This paper presents an advanced ultra-thin photosensitive dielectric Film (PDM) newly developed with high resolution, low CTE and low residual stress for next-generation high-density redistribution layer (RDL), 2.5D interposer, and high-density fan-o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c64a092fc6086f9024ba3a50070647d9
https://doi.org/10.4071/2380-4505-2018.1.000466
https://doi.org/10.4071/2380-4505-2018.1.000466
Autor:
P. Markondeya Raj, Rao Tummala, Fuhan Liu, Amit Agarwal, Daichi Okamoto, Atsushi Kubo, Shreya Dwarakanath, Mohan Kathaperumal
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
High-bandwidth computing with low power requires high-density low-loss interconnects with advanced design rules that cannot be realized with standard epoxies. This paper evaluates the critical material properties required to meet nextgeneration RDL n
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2723f66007cf5d15f4676832f88b59bd
https://doi.org/10.1109/ectc.2019.00114
https://doi.org/10.1109/ectc.2019.00114
Autor:
Daisuke Shibata, Rao Tummala, Yoko Shibasaki, Daichi Okamoto, Tadahiko Hanada, Mohanalingam Kathaperumal, Fuhan Liu
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
In this paper, the authors report on the development of a novel epoxy-based photosensitive dielectric dry film material (PDM). The PDM has two key features: 1) Low CTE value of 30 ppm/°C resulting from the concentration optimization of nano-sized fi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::787c29bca070655b8bb495e577ea3fc3
https://doi.org/10.1109/ectc.2019.00-31
https://doi.org/10.1109/ectc.2019.00-31
Autor:
Venky Sundaram, Tadahiko Hanada, Fuhan Liu, Daisuke Shibata, Rao Tummala, Yoko Shibasaki, Daichi Okamoto
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
In this paper, we introduce an advanced photosensitive dielectric material (PDM) we recently developed to realize a high resolution and low coefficient thermal expansion (CTE) for next-generation high-density re-distribution layer (RDL) for 2.5D inte
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::502ea73433b68ec4bcd59af0a79676a9
https://doi.org/10.1109/ectc.2018.00234
https://doi.org/10.1109/ectc.2018.00234
Autor:
Kazutami Arimoto, Yoichiro Sato, Yoshihiro Sejima, Tomoyuki Yokogawa, Daichi Okamoto, Masafumi Kondo
Publikováno v:
CANDAR
An increase of half-hearing person caused by progressive aging of society in our country leads to an increase in demand for a digital hearing aid with a DSP. Because of a hard physical limit for battery capacity which stems from its wearing form, the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b024824223f53e6c5f64445546262f29
https://doi.org/10.1109/candar.2016.0086
https://doi.org/10.1109/candar.2016.0086
Publikováno v:
IEEJ Transactions on Electronics, Information and Systems. 130:2159-2166
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0eff22240efd8c78d9dd3ce2b7849df1
https://doi.org/10.1541/ieejeiss.130.2159
https://doi.org/10.1541/ieejeiss.130.2159