An implantable piezoelectric ultrasound stimulator (ImPULS) for deep brain activation.

Autor: Hou JF; Media Lab, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA., Nayeem MOG; Media Lab, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA., Caplan KA; Department of Brain and Cognitive Sciences, McGovern Institute for Brain Research, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA., Ruesch EA; Department of Psychological and Brain Sciences, The Center for Systems Neuroscience, Boston University, Boston, 02215, MA, USA., Caban-Murillo A; Department of Psychological and Brain Sciences, The Center for Systems Neuroscience, Boston University, Boston, 02215, MA, USA., Criado-Hidalgo E; Division of Chemistry and Chemical Engineering, California Institute of Technology, Pasadena, CA, 91125, USA., Ornellas SB; Media Lab, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA., Williams B; Center for Systems Neuroscience, Neurophotonics Center, Department of Biomedical Engineering, Boston University, 610 Commonwealth Ave., Boston, MA, 02215, USA., Pearce AA; Department of Brain and Cognitive Sciences, McGovern Institute for Brain Research, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA., Dagdeviren HE; Department of Neurosurgery, Faculty of Medicine, Istanbul University, Istanbul, 34093, Turkey., Surets M; Department of Psychological and Brain Sciences, The Center for Systems Neuroscience, Boston University, Boston, 02215, MA, USA., White JA; Center for Systems Neuroscience, Neurophotonics Center, Department of Biomedical Engineering, Boston University, 610 Commonwealth Ave., Boston, MA, 02215, USA., Shapiro MG; Division of Chemistry and Chemical Engineering, California Institute of Technology, Pasadena, CA, 91125, USA., Wang F; Department of Brain and Cognitive Sciences, McGovern Institute for Brain Research, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA., Ramirez S; Department of Psychological and Brain Sciences, The Center for Systems Neuroscience, Boston University, Boston, 02215, MA, USA., Dagdeviren C; Media Lab, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA. canand@media.mit.edu.

Publikováno v: Nature communications [Nat Commun] 2024 Jun 04; Vol. 15 (1), pp. 4601. Date of Electronic Publication: 2024 Jun 04.

An Emerging Era: Conformable Ultrasound Electronics.

Autor: Zhang L; Media Lab, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA., Du W; Media Lab, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA., Kim JH; Media Lab, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA., Yu CC; Media Lab, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA., Dagdeviren C; Media Lab, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA.

Publikováno v: Advanced materials (Deerfield Beach, Fla.) [Adv Mater] 2024 Feb; Vol. 36 (8), pp. e2307664. Date of Electronic Publication: 2023 Dec 06.

A Conformable Ultrasound Patch for Cavitation-Enhanced Transdermal Cosmeceutical Delivery.

Autor: Yu CC; Media Lab, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA.; Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA., Shah A; Media Lab, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA., Amiri N; Department of Mechanical and Aerospace Engineering, University at Buffalo, Buffalo, NY, 14260, USA., Marcus C; Media Lab, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA.; Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA., Nayeem MOG; Media Lab, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA., Bhayadia AK; Department of Mechanical and Aerospace Engineering, University at Buffalo, Buffalo, NY, 14260, USA., Karami A; Department of Mechanical and Aerospace Engineering, University at Buffalo, Buffalo, NY, 14260, USA., Dagdeviren C; Media Lab, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA.

Publikováno v: Advanced materials (Deerfield Beach, Fla.) [Adv Mater] 2023 Jun; Vol. 35 (23), pp. e2300066. Date of Electronic Publication: 2023 Apr 19.

Technology Roadmap for Flexible Sensors.

Autor: Luo Y; Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore.; Innovative Centre for Flexible Devices (iFLEX), School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore., Abidian MR; Department of Biomedical Engineering, University of Houston, Houston, Texas 77024, United States., Ahn JH; School of Electrical and Electronic Engineering, Yonsei University, Seoul 03722, Republic of Korea., Akinwande D; Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712, United States.; Microelectronics Research Center, The University of Texas at Austin, Austin, Texas 78758, United States., Andrews AM; Department of Chemistry and Biochemistry, California NanoSystems Institute, and Department of Psychiatry and Biobehavioral Sciences, Semel Institute for Neuroscience and Human Behavior, and Hatos Center for Neuropharmacology, University of California, Los Angeles, Los Angeles, California 90095, United States., Antonietti M; Colloid Chemistry Department, Max Planck Institute of Colloids and Interfaces, 14476 Potsdam, Germany., Bao Z; Department of Chemical Engineering, Stanford University, Stanford, California 94305, United States., Berggren M; Laboratory of Organic Electronics, Department of Science and Technology, Campus Norrköping, Linköping University, 83 Linköping, Sweden.; Wallenberg Initiative Materials Science for Sustainability (WISE) and Wallenberg Wood Science Center (WWSC), SE-100 44 Stockholm, Sweden., Berkey CA; Department of Materials Science and Engineering, Stanford University, Stanford, California 94301, United States., Bettinger CJ; Department of Biomedical Engineering and Department of Materials Science and Engineering, Carnegie Mellon University, Pittsburgh, Pennsylvania 15213, United States., Chen J; Department of Bioengineering, University of California, Los Angeles, Los Angeles, California 90095, United States., Chen P; School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore., Cheng W; Nanobionics Group, Department of Chemical and Biological Engineering, Monash University, Clayton, Australia, 3800.; Monash Institute of Medical Engineering, Monash University, Clayton, Australia3800., Cheng X; Applied Mechanics Laboratory, Department of Engineering Mechanics, Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, PR China., Choi SJ; Division of Materials of Science and Engineering, Hanyang University, 222 Wangsimni-ro, Seongdong-gu, Seoul 04763, Republic of Korea., Chortos A; School of Mechanical Engineering, Purdue University, West Lafayette, Indiana 47906, United States., Dagdeviren C; Media Lab, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States., Dauskardt RH; Department of Materials Science and Engineering, Stanford University, Stanford, California 94301, United States., Di CA; Beijing National Laboratory for Molecular Sciences, CAS Key Laboratory of Organic Solids, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China., Dickey MD; Department of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, North Carolina 27606, United States., Duan X; Department of Chemistry and Biochemistry, California NanoSystems Institute, University of California, Los Angeles, Los Angeles, California 90095, United States., Facchetti A; Department of Chemistry and the Materials Research Center, Northwestern University, Evanston, Illinois 60208, United States., Fan Z; Department of Electronic and Computer Engineering and Department of Chemical and Biological Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong SAR, China., Fang Y; School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore., Feng J; State Key Laboratory of Molecular Engineering of Polymers, Department of Macromolecular Science, and Laboratory of Advanced Materials, Fudan University, Shanghai 200438, PR China., Feng X; Laboratory of Flexible Electronics Technology, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China., Gao H; School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore 639798, Singapore.; Institute of High Performance Computing (IHPC), Agency for Science, Technology and Research (A*STAR), 1 Fusionopolis Way, #16-16 Connexis, Singapore 138632, Republic of Singapore., Gao W; Andrew and Peggy Cherng Department of Medical Engineering, California Institute of Technology, Pasadena, California, 91125, United States., Gong X; Department of Chemical Engineering, Department of Materials Science and Engineering, Department of Electrical Engineering and Computer Science, Applied Physics Program, and Macromolecular Science and Engineering Program, University of Michigan, Ann Arbor, Michigan, 48109 United States., Guo CF; Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen 518055, China., Guo X; National Key Laboratory of Science and Technology on Micro/Nano Fabrication, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China., Hartel MC; Department of Bioengineering, University of California, Los Angeles, Los Angeles, California 90095, United States., He Z; Beijing National Laboratory for Molecular Sciences, CAS Key Laboratory of Organic Solids, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China., Ho JS; Institute for Health Innovation and Technology, National University of Singapore, Singapore 117599, Singapore.; Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore.; The N.1 Institute for Health, National University of Singapore, Singapore 117456, Singapore., Hu Y; School of Electronics and Center for Carbon-Based Electronics, Peking University, Beijing 100871, China., Huang Q; School of Fashion and Textiles, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong SAR, China., Huang Y; Department of Materials Science and Engineering, California NanoSystems Institute, University of California, Los Angeles, Los Angeles, California 90095, United States., Huo F; Key Laboratory of Flexible Electronics (KLOFE) and Institute of Advanced Materials (IAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing 211816, PR China., Hussain MM; mmh Labs, Elmore Family School of Electrical and Computer Engineering, Purdue University, West Lafayette, Indiana 47906, United States., Javey A; Electrical Engineering and Computer Sciences, University of California, Berkeley, California 94720, United States.; Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, California 94720, United States., Jeong U; Department of Materials Science and Engineering, Pohang University of Science and Engineering (POSTECH), Pohang, Gyeong-buk 37673, Korea., Jiang C; Department of Electronic Engineering, Tsinghua University, Beijing 100084, China., Jiang X; Department of Biomedical Engineering, Southern University of Science and Technology, No 1088, Xueyuan Road, Xili, Nanshan District, Shenzhen, Guangdong 518055, PR China., Kang J; Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea., Karnaushenko D; Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology, Chemnitz 09126, Germany., Khademhosseini A; Terasaki Institute for Biomedical Innovation, Los Angeles, CA, USA., Kim DH; Center for Nanoparticle Research, Institute for Basic Science (IBS), School of Chemical and Biological Engineering, Seoul National University, Seoul 08826, Republic of Korea., Kim ID; Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea., Kireev D; Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712, United States.; Microelectronics Research Center, The University of Texas at Austin, Austin, Texas 78758, United States., Kong L; School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore., Lee C; Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore.; Center for Intelligent Sensors and MEMS (CISM), National University of Singapore, Singapore 117608, Singapore.; National University of Singapore Suzhou Research Institute (NUSRI), Suzhou Industrial Park, Suzhou 215123, China.; NUS Graduate School-Integrative Sciences and Engineering Programme (ISEP), National University of Singapore, Singapore 119077, Singapore., Lee NE; School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Kyunggi-do 16419, Republic of Korea., Lee PS; School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore.; Singapore-HUJ Alliance for Research and Enterprise (SHARE), Campus for Research Excellence and Technological Enterprise (CREATE), Singapore 138602, Singapore., Lee TW; Department of Materials Science and Engineering, Seoul National University, Seoul 08826, Republic of Korea.; School of Chemical and Biological Engineering, Seoul National University, Seoul 08826, Republic of Korea.; Institute of Engineering Research, Research Institute of Advanced Materials, Seoul National University, Soft Foundry, Seoul 08826, Republic of Korea.; Interdisciplinary Program in Bioengineering, Seoul National University, Seoul 08826, Republic of Korea., Li F; College of Chemistry and Materials Science, Jinan University, Guangzhou, Guangdong 510632, China., Li J; Department of Biomedical Engineering, Department of Electrical and Computer Engineering, Neuroscience Program, BioMolecular Science Program, and Institute for Quantitative Health Science and Engineering, Michigan State University, East Lansing, Michigan 48823, United States., Liang C; School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin, Heilongjiang 150001, China., Lim CT; Department of Biomedical Engineering, National University of Singapore, Singapore 117583, Singapore.; Mechanobiology Institute, National University of Singapore, Singapore 117411, Singapore.; Institute for Health Innovation and Technology, National University of Singapore, Singapore 119276, Singapore., Lin Y; School of Microelectronics, Southern University of Science and Technology, Shenzhen 518055, China., Lipomi DJ; Department of Nano and Chemical Engineering, University of California, San Diego, La Jolla, California 92093-0448, United States., Liu J; John A. Paulson School of Engineering and Applied Sciences, Harvard University, Boston, Massachusetts, 02134, United States., Liu K; School of Chemistry and Chemical Engineering, Frontiers Science Center for Transformative Molecules, Shanghai Jiao Tong University, Shanghai 200240, PR China., Liu N; Beijing Key Laboratory of Energy Conversion and Storage Materials, College of Chemistry, Beijing Normal University, Beijing 100875, PR China., Liu R; John A. Paulson School of Engineering and Applied Sciences, Harvard University, Boston, Massachusetts, 02134, United States., Liu Y; Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore.; Department of Biomedical Engineering, N.1 Institute for Health, Institute for Health Innovation and Technology (iHealthtech), National University of Singapore, Singapore 119077, Singapore., Liu Y; Department of Mechanical and Aerospace Engineering, North Carolina State University, Raleigh, North Carolina 27695, United States., Liu Z; Neural Engineering Centre, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China 518055., Liu Z; Institute of High Performance Computing (IHPC), Agency for Science, Technology and Research (A*STAR), 1 Fusionopolis Way, #16-16 Connexis, Singapore 138632, Republic of Singapore., Loh XJ; Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore., Lu N; Department of Aerospace Engineering and Engineering Mechanics, Department of Electrical and Computer Engineering, Department of Mechanical Engineering, Department of Biomedical Engineering, Texas Materials Institute, The University of Texas at Austin, Austin, Texas 78712, United States., Lv Z; Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore., Magdassi S; Institute of Chemistry and the Center for Nanoscience and Nanotechnology, The Hebrew University of Jerusalem, Jerusalem 9190401, Israel., Malliaras GG; Electrical Engineering Division, Department of Engineering, University of Cambridge CB3 0FA, Cambridge United Kingdom., Matsuhisa N; Institute of Industrial Science, The University of Tokyo, 4-6-1 Komaba, Meguro-ku, Tokyo 153-8505, Japan., Nathan A; Darwin College, University of Cambridge, Cambridge CB3 9EU, United Kingdom., Niu S; Department of Biomedical Engineering, Rutgers University, Piscataway, New Jersey 08854, United States., Pan J; Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore., Pang C; School of Chemical Engineering and Samsung Advanced Institute for Health Science and Technology, Sungkyunkwan University, Suwon 16419, Republic of Korea., Pei Q; Department of Materials Science and Engineering, Department of Mechanical and Aerospace Engineering, California NanoSystems Institute, University of California, Los Angeles, Los Angeles, California 90095, United States., Peng H; State Key Laboratory of Molecular Engineering of Polymers, Department of Macromolecular Science, and Laboratory of Advanced Materials, Fudan University, Shanghai 200438, PR China., Qi D; School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin, Heilongjiang 150001, China., Ren H; Department of Chemistry and Biochemistry, University of California, Los Angeles, Los Angeles, California, 90095, United States., Rogers JA; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, United States.; Department of Materials Science and Engineering, Department of Mechanical Engineering, Department of Biomedical Engineering, Departments of Electrical and Computer Engineering and Chemistry, and Department of Neurological Surgery, Northwestern University, Evanston, Illinois 60208, United States., Rowe A; Becton, Dickinson and Company, 1268 N. Lakeview Avenue, Anaheim, California 92807, United States.; Ready, Set, Food! 15821 Ventura Blvd #450, Encino, California 91436, United States., Schmidt OG; Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology, Chemnitz 09126, Germany.; Material Systems for Nanoelectronics, Chemnitz University of Technology, Chemnitz 09107, Germany.; Nanophysics, Faculty of Physics, TU Dresden, Dresden 01062, Germany., Sekitani T; The Institute of Scientific and Industrial Research (SANKEN), Osaka University, Osaka, Japan 5670047., Seo DG; Department of Materials Science and Engineering, Seoul National University, Seoul 08826, Republic of Korea., Shen G; School of Integrated Circuits and Electronics, Beijing Institute of Technology, Beijing 100081, China., Sheng X; Department of Electronic Engineering, Beijing National Research Center for Information Science and Technology, Institute for Precision Medicine, Center for Flexible Electronics Technology, and IDG/McGovern Institute for Brain Research, Tsinghua University, Beijing, 100084, China., Shi Q; Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore.; Center for Intelligent Sensors and MEMS (CISM), National University of Singapore, Singapore 117608, Singapore.; National University of Singapore Suzhou Research Institute (NUSRI), Suzhou Industrial Park, Suzhou 215123, China., Someya T; Department of Electrical Engineering and Information Systems, Graduate School of Engineering, The University of Tokyo, Tokyo 113-8656, Japan., Song Y; Key Laboratory of Green Printing, Institute of Chemistry, Chinese Academy of Sciences, Beijing, Beijing 100190, China., Stavrinidou E; Laboratory of Organic Electronics, Department of Science and Technology, Linköping University, SE-601 74 Norrkoping, Sweden., Su M; Key Laboratory of Green Printing, Institute of Chemistry, Chinese Academy of Sciences, Beijing, Beijing 100190, China., Sun X; State Key Laboratory of Molecular Engineering of Polymers, Department of Macromolecular Science, and Laboratory of Advanced Materials, Fudan University, Shanghai 200438, PR China., Takei K; Department of Physics and Electronics, Osaka Metropolitan University, Sakai, Osaka 599-8531, Japan., Tao XM; Research Institute for Intelligent Wearable Systems, School of Fashion and Textiles, Hong Kong Polytechnic University, Hong Kong, China., Tee BCK; Materials Science and Engineering, National University of Singapore, Singapore 117575, Singapore.; iHealthtech, National University of Singapore, Singapore 119276, Singapore., Thean AV; Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore.; Singapore Hybrid-Integrated Next-Generation μ-Electronics Centre (SHINE), Singapore 117583, Singapore., Trung TQ; School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Kyunggi-do 16419, Republic of Korea., Wan C; School of Electronic Science and Engineering, Nanjing University, Nanjing 210023, China., Wang H; Department of Biomedical Engineering, University of Texas at Austin, Austin, Texas 78712, United States., Wang J; Department of Nanoengineering, University of California, San Diego, California 92093, United States., Wang M; Frontier Institute of Chip and System, State Key Laboratory of Integrated Chip and Systems, Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai, 200433, China.; the Shanghai Qi Zhi Institute, 41th Floor, AI Tower, No.701 Yunjin Road, Xuhui District, Shanghai 200232, China., Wang S; Pritzker School of Molecular Engineering, The University of Chicago, Chicago, Illinois, 60637, United States., Wang T; State Key Laboratory of Organic Electronics and Information Displays and Jiangsu Key Laboratory for Biosensors, Institute of Advanced Materials (IAM), Nanjing University of Posts and Telecommunications, 9 Wenyuan Road, Nanjing 210023, China., Wang ZL; Beijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences, Beijing 100083, China.; Georgia Institute of Technology, Atlanta, Georgia 30332-0245, United States., Weiss PS; California NanoSystems Institute, Department of Chemistry and Biochemistry, Department of Bioengineering, and Department of Materials Science and Engineering, University of California, Los Angeles, Los Angeles, California 90095, United States., Wen H; School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore.; Institute of Flexible Electronics Technology of THU, Jiaxing, Zhejiang, China 314000., Xu S; Department of Nanoengineering, Department of Electrical and Computer Engineering, Materials Science and Engineering Program, and Department of Bioengineering, University of California San Diego, La Jolla, California, 92093, United States., Xu T; School of Biomedical Engineering, Health Science Center, Shenzhen University, Shenzhen, Guangdong, 518060, PR China., Yan H; Department of Chemical Engineering, Stanford University, Stanford, California 94305, United States., Yan X; School of Chemistry and Chemical Engineering, Frontiers Science Center for Transformative Molecules, Shanghai Jiao Tong University, Shanghai 200240, PR China., Yang H; Tianjin Key Laboratory of Molecular Optoelectronic Sciences, Department of Chemistry, School of Science, Tianjin University, Tianjin, China, 300072., Yang L; Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore.; Department of Materials Science and Engineering, National University of Singapore (NUS), 9 Engineering Drive 1, #03-09 EA, Singapore 117575, Singapore., Yang S; School of Biomedical Sciences, Faculty of Biological Sciences, University of Leeds, Leeds, LS2 9JT, United Kingdom., Yin L; School of Materials Science and Engineering, The Key Laboratory of Advanced Materials of Ministry of Education, State Key Laboratory of New Ceramics and Fine Processing, and Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China., Yu C; Department of Engineering Science and Mechanics, Department of Biomedical Engineering, Department of Material Science and Engineering, Materials Research Institute, Pennsylvania State University, University Park, Pennsylvania, 16802, United States., Yu G; Materials Science and Engineering Program and Walker Department of Mechanical Engineering, The University of Texas at Austin, Austin, Texas, 78712, United States., Yu J; School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore., Yu SH; Department of Chemistry, Institute of Biomimetic Materials and Chemistry, Hefei National Research Center for Physical Science at the Microscale, University of Science and Technology of China, Hefei 230026, China., Yu X; Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China., Zamburg E; Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore.; Singapore Hybrid-Integrated Next-Generation μ-Electronics Centre (SHINE), Singapore 117583, Singapore., Zhang H; National Key Laboratory of Science and Technology on Micro/Nano Fabrication; Beijing Advanced Innovation Center for Integrated Circuits, School of Integrated Circuits, Peking University, Beijing 100871, China., Zhang X; Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore.; Singapore Hybrid-Integrated Next-Generation μ-Electronics Centre (SHINE), Singapore 117583, Singapore., Zhang X; School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China., Zhang X; School of Biomedical Engineering, Health Science Center, Shenzhen University, Shenzhen, Guangdong 518060, PR China., Zhang Y; Applied Mechanics Laboratory, Department of Engineering Mechanics; Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, PR China., Zhang Y; Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore.; Singapore Hybrid-Integrated Next-Generation μ-Electronics Centre (SHINE), Singapore 117583, Singapore., Zhao S; John A. Paulson School of Engineering and Applied Sciences, Harvard University, Boston, Massachusetts, 02134, United States., Zhao X; Department of Mechanical Engineering, Department of Civil and Environmental Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts, 02139, United States., Zheng Y; Center for Integrated Circuits and Systems, School of Electrical and Electronic Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Singapore., Zheng YQ; National Key Laboratory of Science and Technology on Micro/Nano Fabrication; School of Integrated Circuits, Peking University, Beijing 100871, China., Zheng Z; Department of Applied Biology and Chemical Technology, Faculty of Science, Research Institute for Intelligent Wearable Systems, Research Institute for Smart Energy, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong SAR, China., Zhou T; Center for Neural Engineering, Department of Engineering Science and Mechanics, The Huck Institutes of the Life Sciences, Materials Research Institute, The Pennsylvania State University, University Park, Pennsylvania 16802, United States., Zhu B; Key Laboratory of 3D Micro/Nano Fabrication and Characterization of Zhejiang Province, School of Engineering, Westlake University, Hangzhou 310024, China., Zhu M; Institute for Digital Molecular Analytics and Science (IDMxS), Nanyang Technological University, 59 Nanyang Drive, Singapore 636921, Singapore., Zhu R; Department of Precision Instrument, Tsinghua University, Beijing 100084, China., Zhu Y; Terasaki Institute for Biomedical Innovation, Los Angeles, California, 90064, United States., Zhu Y; Department of Mechanical and Aerospace Engineering, Department of Materials Science and Engineering, and Department of Biomedical Engineering, North Carolina State University, Raleigh, North Carolina 27695, United States., Zou G; Institute of High Performance Computing (IHPC), Agency for Science, Technology and Research (A*STAR), 1 Fusionopolis Way, #16-16 Connexis, Singapore 138632, Republic of Singapore., Chen X; Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore.; Innovative Center for Flexible Devices (iFLEX), Max Planck-NTU Joint Laboratory for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore.

Publikováno v: ACS nano [ACS Nano] 2023 Mar 28; Vol. 17 (6), pp. 5211-5295. Date of Electronic Publication: 2023 Mar 09.

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