Zobrazeno 1 - 10
of 56
pro vyhledávání: '"Dag Andersson"'
Autor:
Wilhelm Söderkvist Vermelin, Madhav Mishra, Mattias P. Eng, Dag Andersson, Konstantinos Kyprianidis
Publikováno v:
International Journal of Prognostics and Health Management, Vol 15, Iss 2 (2024)
Remaining useful life prediction models are a central aspect of developing modern and capable prognostics and health management systems. Recently, such models are increasingly data-driven and based on various machine learning techniques, in particula
Externí odkaz:
https://doaj.org/article/099a6ab4995c44699c1b429dea8c3bcf
Autor:
Saeed Akbari, Konstantin Kostov, Klas Brinkfeldt, Erik Adolfsson, Jang-Kwon Lim, Dag Andersson, Mietek Bakowski, Qin Wang, Michael Salter
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:1857-1866
Publikováno v:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Autor:
Göran Wetter, Dag Andersson, Mikael Kwarnmark, Johnny Goncalves, Per-Erik Tegehall, Andreas Lovberg, Jan Strandberg, Klas Brinkfeldt, Jonas Söderlund
Publikováno v:
Journal of Electronic Packaging. 141
The increasing complexity of electronics in systems used in safety critical applications, such as self-driving vehicles, requires new methods to assure the hardware reliability of the electronic assemblies. Prognostics and health management (PHM) tha
Lead-free tin-based solder joints often have a single-grained structure with random orientation and highly anisotropic properties. These alloys are typically stiffer than lead-based solders, hence transfer more stress to printed circuit boards (PCBs)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8ed90ea0020030213213403d548a3983
http://urn.kb.se/resolve?urn=urn:nbn:se:ri:diva-37331
http://urn.kb.se/resolve?urn=urn:nbn:se:ri:diva-37331
Autor:
Göran Wetter, Andreas Lovberg, Zsolt Toth-Pal, Dag Andersson, Klas Brinkfeldt, Samer Shisha, Mattias Forslund
Publikováno v:
ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
As the automotive industry shifts towards the electrification of drive trains, the efficiency of power electronics becomes more important. The use of silicon carbide (SiC) devices in power electronics has shown several benefits in efficiency, blockin
Autor:
Jonas Söderlund, Andreas Lovberg, Klas Brinkfeldt, Dag Andersson, Mikael Kwarnmark, Johnny Goncalves, Jan Strandberg, Per-Erik Tegehall, Göran Wetter
Publikováno v:
ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
The increasing complexity of electronics in systems used in safety critical applications, such as for example self-driving vehicles requires new methods to assure the hardware reliability of the electronic assemblies. Prognostics and Health Managemen
Autor:
Hans Gronqvist, Helene Karlsson, Dag Andersson, Oscar Lidström, Niina Hernández, Jan Wipenmyr
Publikováno v:
2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).
The overall objective of the project wearITmed, Wearable sensors in smart textiles, is to develop a novel wearable sensor system demonstrator. This sensor system aims to monitor symptoms of neurological disorders such as epilepsy, Parkinson’s disea
Publikováno v:
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Lead-free solder joints have been shown to increase the risk for crack formation in the PCB laminate under the solder pads. As such cracks propagate during thermal cycling, they decrease the strain imposed on the solderjoint by acting as strain relie
Autor:
Yineng Wang, Dag Andersson, Guy Voirin, Heike Wünscher, Arndt Steinke, Hans Gronqvist, Rainer Gunzler, Stephan Karmann, Eric Moore, Sophie Billat, Petra Weiler, Marco Belcastro, Maria Tijero, Andreas Albrecht, Xi Cao, Patricia Vazquez, Thomas Frank, Anna Hogan, K Mayora
Publikováno v:
2018 Pan Pacific Microelectronics Symposium (Pan Pacific).
The three year EU project SMARTER-SI that ends in January 2018 has tested a new concept for small lot manufacturing for SMEs which we call the Cooperative Foundry Model (CFM). During previous research, all RTOs have completed building blocks, i.e. co