Zobrazeno 1 - 10
of 32
pro vyhledávání: '"Daewoong Suh"'
Autor:
Soon Re Kim, Tae-Rin Kwon, Yu-Jin Jang, Kwang Ho Yoo, Eun Ja Choi, Chang Taek Oh, Beom Joon Kim, Daewoong Suh, Eun Jung Ko
Publikováno v:
Lasers in Surgery and Medicine. 47:824-832
Background and Objectives Ultraviolet light-emitting diodes (UV-LEDs) are a novel light source for phototherapy. This research investigated the in vitro safety and efficacy of UV-LEDs as a phototherapeutic device for atopic dermatitis (AD). Study Des
Autor:
Seoung-Hwan Park, Daewoong Suh
Publikováno v:
physica status solidi (b). 252:1844-1847
The light emission characteristics of ultraviolet (UV) AlGaN/AlN quantum well (QW) structures with the AlGaN delta-layer in the active region were investigated using the multiband effective-mass theory and non-Markovian gain model. In a wavelength ra
Autor:
Jin-Yoo Suh, Carol M. Garland, R. Dale Conner, William L. Johnson, Boonrat Lohwongwatana, Daewoong Suh
Publikováno v:
Scripta Materialia. 59:905-908
A novel thermoplastic bonding concept is demonstrated based on the unique rheological behavior and pattern-replicating ability of bulk metallic glass (BMG)-forming liquids. In this approach, the BMG is heated above Tg to the “supercooled liquid”
Publikováno v:
JOM. 60:71-76
A novel low-temperature solder that consists entirely of two phases of intermetallic compounds has been developed as a reliable low-temperature interconnect. The new solder can be reflowed below 125°C and yet exhibits excellent mechanical properties
Publikováno v:
Materials Letters. 62:2017-2020
A novel low-temperature solder which consists entirely of two phases of intermetallic compounds is reported. The new solder can be reflowed below 125 °C and yet maintains high-temperature mechanical properties at homologous temperatures exceeding 0.
Autor:
Hyunchul Kim, Chetan M. Kumar, Dong W. Kim, Jessica A. Weninger, Hazel B. Tejada, Aparna Prasad, Brian W. Grimsley, Pilin Liu, Daewoong Suh
Publikováno v:
Materials Science and Engineering: A. :595-603
Effects of Ag content on fracture resistance of Sn–Ag–Cu solders under high-strain rate conditions are examined in an attempt to optimize bulk properties of solders for enhanced drop performance. The concept of extrinsic toughening is invoked for
Autor:
Tae-Rin, Kwon, Chang Taek, Oh, Eun Ja, Choi, Soon Re, Kim, Yu-Jin, Jang, Eun Jung, Ko, Daewoong, Suh, Kwang Ho, Yoo, Beom Joon, Kim
Publikováno v:
Lasers in surgery and medicine. 47(10)
Ultraviolet light-emitting diodes (UV-LEDs) are a novel light source for phototherapy. This research investigated the in vitro safety and efficacy of UV-LEDs as a phototherapeutic device for atopic dermatitis (AD).Human keratinocytes and fibroblasts
Autor:
Philip A. Sterne, Reinhold H. Dauskardt, Richard H. Howell, Palakkal Asoka-Kumar, Daewoong Suh
Publikováno v:
Journal of Materials Research. 18:2021-2024
A strong temperature dependence of positron annihilation with low-momentum electrons is reported for a Zr-based bulk metallic glass in the temperature range 50–300 K. The observed behavior was rationalized in terms of shallow versus deep positron t
Autor:
Reinhold H. Dauskardt, Daewoong Suh
Publikováno v:
Journal of Non-Crystalline Solids. 317:181-186
The plane strain fracture toughness of a Zr–Ti–Ni–Cu–Be bulk metallic glass was found to be significantly degraded after annealing at 300 °C. The fracture morphology was changed from characteristic vein patterns to cleavage-like features wit
Autor:
Reinhold H. Dauskardt, Daewoong Suh
Publikováno v:
Annales de Chimie Science des Matériaux. 27:25-40
Effects of atomic-scale open-volume regions in metallic glass structure on the flow and fracture behavior of a Zr-Ti-Ni-Cu-Be bulk metallic glass were examined. Metallic glass structure was changed by annealing at 300 °C. Studies of relaxation time