Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Daehan Han"'
Autor:
Bumjin Choi, Jinyoung Kang, Yong-Hyeon Kim, Kyusun Lee, Hyoungsun Hong, Gyo-Young Jin, Aeran Hong, Kweonjae Lee, Joosung Lee, Jinman Chang, Tae-Heon Kim, Hyoung Jun Kim, Daehan Han
Publikováno v:
SPIE Proceedings.
In a sub 2Xnm node process, the feedback of pattern weak points is more and more significant. Therefore, it is very important to extract the systemic defect in Double Patterning Technology(DPT), however, it is impossible to predict exact systemic def
Autor:
Tae-Heon Kim, Yong-Hyeon Kim, Hyeongsun Hong, Joo-young Lee, Jinman Chang, Kyu-Pil Lee, Daehan Han, Jinyoung Kang, Aeran Hong, Bumjin Choi, Gyo-Young Jin, Kyusun Lee, Kweonjae Lee, Joosung Lee
Publikováno v:
SPIE Proceedings.
It is increasingly difficult to determine degree of completion of the patterning and the distribution at the DRAM Cell Patterns. When we research DRAM Device Cell Pattern, there are three big problems currently, it is as follows. First, due to etch l
Autor:
Jinman Chang, Kyu-Pil Lee, Tae-Heon Kim, Hyeongsun Hong, Kye-hee Yeom, Kyusun Lee, Aeran Hong, Yong-Hyeon Kim, Kweonjae Lee, Joosung Lee, Jinyoung Kang, Joo-young Lee, Bumjin Choi, Gyo-Young Jin, Daehan Han
Publikováno v:
SPIE Proceedings.
Starting with the sub 2Xnm node, the process window becomes smaller and tighter than before. Pattern related error budget is required for accurate critical-dimension control of Cell layers. Therefore, lithography has been faced with its various diffi
Autor:
Kinam Kim, Hyungtak Kim, Sung-Sam Lee, Daehan Han, Yun-gi Kim, Byung-Il Ryu, Sang-Ho Kim, Chang-hyun Cho, Saehan Kwon, J.M. Park, Sungho Jang, Yangsoo Sung, Sangmin Jun, Wontae Park, Ji-Hoon Kim
Publikováno v:
Physica C: Superconductivity. 423:29-36
For the first time, we developed 70nm DRAM technology applicable to a manufacturing level. This technology is aimed at DDR-3 application, which requires low-voltage operation and high speed performance. Fully working 70nm DRAMs were realized combinin
Autor:
Kweonjae Lee, Joosung Lee, Tae-Heon Kim, Aeran Hong, Daehan Han, Yongjik Park, Yong-Hyeon Kim, Yun-Hye Chu
Publikováno v:
Design for Manufacturability through Design-Process Integration VI.
As semiconductor process technology scales down to sub 30nm process node and beyond dimensions, the printability and process window of the lithographic patterns are seriously reduced due to the fundamental limit of the lithography and process variati
Autor:
Daehan Han, Yoon-Min Kim, Aeran Hong, In-Ho Nam, Hong-Ji Lee, Min-Chul Han, Kyungseok Oh, Yongjik Park, Yong-Hyeon Kim, Tae Heon Kim
Publikováno v:
SPIE Proceedings.
Semiconductor industry has been experiencing rapid and continuous shrinkage of feature size along with Moore's law. As the VLSI technology scales down to sub 40nm process node. Control of critical dimension (CD) and Extraction of Unanticipated weak p
Autor:
null Hyungtak Kim, null Sangho Kim, null Sungsam Lee, null Sungho Jang, null Ji-hoon Kim, null Yangsoo Sung, J. Puk, null Saehan Kwon, null Sangmin Jun, null Wontae Park, null Daehan Han, null Changhyun Cho, null Yungi Kim, null Kinam Kim, null Byungil Ryu
Publikováno v:
IEEE VLSI-TSA International Symposium on VLSI Technology, 2005. (VLSI-TSA-Tech)..
Autor:
Hyungtak Kim, Sangho Kim, Sungsam Lee, Sungho Jang, Ji-hoon Kim, Yangsoo Sung, Junwoong Park, Saehan Kwon, Sangmin Jun, Wontae Park, Daehan Han, Changhyun Cho, Yungi Kim, Kinam Kim, Byungil Ryu
Publikováno v:
IEEE VLSI-TSA International Symposium on VLSI Technology, 2005. (VLSI-TSA-Tech); 2005, p29-30, 2p