Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Daebyoung Kang"'
Autor:
Juhoon Yoon, Dong Su Ryu, Byong Jin Kim, YoungWoo Lee, DaeByoung Kang, GyuIck Jung, Jae Ung Lee, ChoongHoe Kim, EunNaRa Cho, JinYoung Khim, Sun-Joong Kim
Publikováno v:
Journal of the Microelectronics and Packaging Society. 23:43-48
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ad0223858f52cd4bd40eb123e986b51a
https://doi.org/10.6117/kmeps.2016.23.4.043
https://doi.org/10.6117/kmeps.2016.23.4.043
Autor:
Juhoon Yoon, YongHo Son, SeoungJoon Hong, DaeByoung Kang, KiDong Sim, DaeHo Moon, Byong Jin Kim, JinYoung Khim
Publikováno v:
Journal of the Microelectronics and Packaging Society. 23:31-34
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::68730bac0aafaf8a9a6a50436bdc113a
https://doi.org/10.6117/kmeps.2016.23.4.031
https://doi.org/10.6117/kmeps.2016.23.4.031
Autor:
Jin Young Kim, Choonheung Lee, Cha Gyu Song, Sung-Hoon Choa, Eun-Sook Sohn, Hoon Sun Jung, Juhoon Yoon, DaeByoung Kang
Publikováno v:
Nanoscience and Nanotechnology Letters. 8:1-7
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e7f951019472b2cebb303bdbfc6a4e66
https://doi.org/10.1166/nnl.2016.2095
https://doi.org/10.1166/nnl.2016.2095
Autor:
Yanggyoo Jung, Kwangmo Lim, Byoungwoo Cho, TaeHo Yoon, Yunseok Song, Min Ho Kim, DaeByoung Kang, Dongjoo Park, ChoongHoe Kim, JinYoung Khim, SeokHo Na
Publikováno v:
2017 IEEE CPMT Symposium Japan (ICSJ).
The semiconductor packaging technology trend for electronic products continues to achieve greater miniaturization and higher functionality. Thinner profile chip scale packaging (CSP), such as flip chip CSP (fcCSP), with increasing die complexities is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c152e66a7f4dfe6e9886c58c58a408c0
https://doi.org/10.1109/icsj.2017.8240085
https://doi.org/10.1109/icsj.2017.8240085
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
Copper (Cu) wires are increasingly used in semiconductor devices to provide cost-effective packaging. With its excellent electrical properties, copper has higher mechanical properties than gold (Au) wire. Many of the challenges for Cu wire have been
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4197b507462519c8cf17a1e821207700
https://doi.org/10.1109/ectc.2017.263
https://doi.org/10.1109/ectc.2017.263
Autor:
KwangSeok Oh, Jemmy Sutanto, Juhoon Yoon, Robert Lanzone, Ron Huemoeller, DaeByoung Kang, Michael Oh
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2013:000916-000936
This paper describes the ongoing 3 years research and development at Amkor Technology on CoC (Chip on Chip)/FtF (Face to Face) – PossumTM technology. This technology has showed a lot of interests from the microelectronics customers/industries becau
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c29481ac48c48ba17e16e84d0555ae9b
https://doi.org/10.4071/2013dpc-tp33
https://doi.org/10.4071/2013dpc-tp33
Autor:
MinJae Lee, Keun-Soo Kim, Hwankyu Kim, DaeByoung Kang, TaeKyeong Hwang, Juhoon Yoon, David Jon Hiner, Dong Wook Kim, Seokgeun Ahn
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
High throughput interconnection technology has been achieved using a multi-chip gang bonding process with an advanced chip on wafer (CoW) test vehicle (TV). The TV had 30 µm of fine-pitch copper pillar (CuP) and the bonding test was performed using
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c24317a371879b0755b352617f483977
https://doi.org/10.1109/ectc.2016.171
https://doi.org/10.1109/ectc.2016.171
Autor:
MinJae Lee, Riko Radojcic, KeunSoo Kim, Sam Gu, David Jon Hiner, Michael G. Kelly, Seokgeun Ahn, Hwankyu Kim, DaeByoung Kang, Dong Wook Kim, Ron Huemoeller
Publikováno v:
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
Advanced chip on wafer (CoW) assembly has emerged as a key assembly technology for enabling advanced silicon nodes and complex integration. Traditional assembly methods for chip attach have proven capable in this approach, but suffer in the area of f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::058f82acff2c0d5bf40f2ad8f4cbe4aa
https://doi.org/10.1109/ectc.2015.7159565
https://doi.org/10.1109/ectc.2015.7159565
Autor:
KwangSeok Oh, DaeByoung Kang, Robert Lanzone, KyungRok Park, S. Y. Ma, Michael Oh, Juhoon Yoon, Ron Huemoeller, J. Sutanto
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
This paper describes the ongoing research and development at Amkor Technology of Chip-on-chip/Face to Face (CoC/F2F) technology being developed in parallel with Through Silicon Via (TSV) package assembly. Unlike other 3D packaging techniques using TS
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b7197b8218e99dfda72e1dff6237674e
https://doi.org/10.1109/ectc.2013.6575690
https://doi.org/10.1109/ectc.2013.6575690
Autor:
Curtis Zwenger, Shawn O'Connor, Min Yoo, C. Beddingfield, Robert Lanzone, KyungRok Park, DaeByoung Kang, Mark A. Gerber, Robert Francis Darveaux, Sung-Su Park, MinJae Lee
Publikováno v:
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
There has been a growing need for fine pitch flip chip technology in support of next generation communication devices with increasing die complexities. The increase in functionality which drives a larger number of signal I/O's in combination with sma
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::668c0cff4c96ac0b6290307c87ea8358
https://doi.org/10.1109/ectc.2011.5898576
https://doi.org/10.1109/ectc.2011.5898576