Zobrazeno 1 - 10
of 43
pro vyhledávání: '"Dae-Young Kong"'
Autor:
Sergio Brandi, Bianca Maria Pierri, Giorgia Borriello, Ettore Capoluongo, Barbara Izzo, Giuseppe Castaldo, Angelo Boccia, Hong-Yeoul Kim, Lorenzo Chiariotti, Giovanna Fusco, Rosa Della Monica, Dae-Young Kong, Ilaria Iacobucci, Maurizio Viscardi, Margherita Passariello, Roberto Siciliano, Stefano Pascarella, Claudia Tiberio, Camilla Anastasio, Giovanni Paolella, Fatemeh Asadzadeh, Jae-Ho Cheong, Pellegrino Cerino, Luigi Atripaldi, Marika Comegna, Martina Bianchi, Maria Chiara Monti, Fabrizio Quarantelli, Laura Marrone, Kyong-Seop Yun, Ida Pisano, Massimo Zollo, Giuseppina Criscuolo, Claudia De Lorenzo, Veronica Ferrucci
Publikováno v:
Science Signaling
Long-chain polyphosphates inhibit SARS-CoV-2 infection by targeting a host receptor and a viral RNA polymerase.
Polyphosphates versus SARS-CoV-2 Long-chain, inorganic polyphosphates (polyPs), which are found in many cells in the blood, have cyto
Polyphosphates versus SARS-CoV-2 Long-chain, inorganic polyphosphates (polyPs), which are found in many cells in the blood, have cyto
Publikováno v:
Journal of Nanoscience and Nanotechnology. 17:8450-8456
Publikováno v:
Journal of Nanoscience and Nanotechnology. 17:8418-8424
Publikováno v:
Biomedical Science Letters. 22:75-82
The immune system and neuroendocrine systems are the two key components that maintain bodily homeostasis. Peripheral blood specimens can indicate abnormalities in a body, which often cause various threats to human health, including devastating autoim
Publikováno v:
Micro & Nano Letters. 10:528-532
A solar cell texturing process using a two-step process that includes wet etching and dry etching has been developed. The surface reflectance and fill factor (FF) of the pyramid structure by general wet etching texturing process were 5.834 and 70.597
Publikováno v:
physica status solidi (a). 211:1844-1849
We have developed a new texturing method by forming a pyramidal black silicon structure using a metal mesh in the reactive ion etching (RIE) system in order to overcome the disadvantages of the texturing process using wet etching and the drawbacks of
Autor:
Su-Cheong YEOM1,2,3, Dae-Young KONG1,3, Chung-Gyu PARK1,3,4, Byeong-Chun LEE2, Wang-Jae LEE1,3,5 kinglee@snu.ac.kr
Publikováno v:
Animal Science Journal. Apr2010, Vol. 81 Issue 2, p276-279. 4p. 1 Diagram.
Continuous-Flow Microfluidic Polymerase Chain Reaction Chip Using Dry Film Resist on Glass Substrate
Autor:
Dae-Young Kong, Bonghwan Kim, Nam Ho Jeoung, Jong-Hyun Lee, Taewook Kang, Dongin Lee, Chanseob Cho, Byeungleul Lee
Publikováno v:
Advanced Science Letters. 19:1445-1448
Publikováno v:
Journal of Sensor Science and Technology. 22:130-135
This study proposed a noble process to fabricate TSV (Through Silicon Via) structure which has lower cost, shorter production time,and more simple fabrication process than plating method. In order to produce the via holes, the Si wafer was etched by
Publikováno v:
Journal of Sensor Science and Technology. 22:89-94
In this paper, we developed a beam of MEMS probe card using a BeCu sheet. Silicon wafer thickness of 400 m was fabricated byusing deep reactive ion etching (RIE) process. After forming through silicon via (TSV), the silicon wafer was bonded with BeCu