Zobrazeno 1 - 10
of 12
pro vyhledávání: '"Dae Won Suh"'
Autor:
Dae Won Suh, Sung Min Kim
Publikováno v:
Journal of the Institute of Electronics and Information Engineers. 57:99-104
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e84176a06ea9fd5326fbf1c969638449
https://doi.org/10.5573/ieie.2020.57.1.99
https://doi.org/10.5573/ieie.2020.57.1.99
Autor:
Dae-won Suh
Publikováno v:
Journal of The Society of philosophical studies. 123:211-237
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::52876186a7669072d1a69a43d39dbbd4
https://doi.org/10.23908/jsps.2018.12.123.211
https://doi.org/10.23908/jsps.2018.12.123.211
Autor:
Dae-won Suh
Publikováno v:
Journal of The Studies of Taoism and Culture. 49:89-126
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::63cd38db019ec4b39da12e48bf74c6ed
https://doi.org/10.38113/jstc.2018.11.49.89
https://doi.org/10.38113/jstc.2018.11.49.89
Autor:
Dae-won Suh
Publikováno v:
GongJaHak. 35:61-95
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ab5e6e7ab4c371526009182010319aa6
https://doi.org/10.37300/gongja.35.2
https://doi.org/10.37300/gongja.35.2
Autor:
Dae-won Suh
Publikováno v:
Journal of the Institute of Bibliography. :175-192
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3f5db183ad621bad0b76fdc2cbd0fd0b
https://doi.org/10.17258/jib.2017..69.175
https://doi.org/10.17258/jib.2017..69.175
Autor:
Dae-won Suh
Publikováno v:
Journal of the Institute of Bibliography. :209-230
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c1afd18a1dafd1519ef4b0deb0bddc6a
https://doi.org/10.17258/jib.2016..67.209
https://doi.org/10.17258/jib.2016..67.209
Autor:
Dae-won Suh
Publikováno v:
Korean Studies Quarterly. 35:77-89
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f147270600acd04cd66d63c9271ad250
https://doi.org/10.25024/ksq.35.3.201209.77
https://doi.org/10.25024/ksq.35.3.201209.77
Autor:
Keun Ho Lee, Dong Kee Kim, Hyung Kuk Park, Won Joo Kim, Kyoung Heo, Hee Jong Oh, Sung Soo Lee, Je Hyun Park, Jae Moon Kim, Jung Yun Kim, Younghyun Kim, Chong Sub Lee, Sang Am Lee, Byung In Lee, Hong Ki Song, Joo Uhn Kim, Hyunwoo Nam, Joong Ku Kang, Dong Jin Shin, Dae Soo Chung, Sang Ho Kim, Keun Wook Lee, Sung Ho Park, Soon Ki No, Sug Eun Kim, Sang Kun Lee, Seung Bong Hong, Dae Won Suh, Kwangsoo Kim, Sangdo Lee
Publikováno v:
Seizure. 11:255-260
Purpose: A multicentre open clinical trial was conducted to evaluate the clinical usefulness of a slower titration of topiramate (TPM) to 300 mg /day as adjunctive therapy for medically intractable partial epilepsies.Methods: Ninteen centres particip
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8dc5838ac383cb5d92da348f15db96f5
https://doi.org/10.1053/seiz.2001.0605
https://doi.org/10.1053/seiz.2001.0605
Publikováno v:
Journal of Composite Materials. 35:264-278
Equilibrium water absorption behavior of epoxy/carbon fiber composites was investigated under hygrothermal conditions. The temperature dependence of the equilibrium water uptake was quantitatively determined by assuming two distinctly different physi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::301c1b3df122a3bcb52e4288f3425034
https://doi.org/10.1177/002199801772662253
https://doi.org/10.1177/002199801772662253
Publikováno v:
ICVC '99. 6th International Conference on VLSI and CAD (Cat. No.99EX361).
The chemical mechanical polishing (CMP) of polysilicon is an important technique to form polysilicon plugs or damascene lines in a sub-quarter micron DRAM device. The removal of polysilicon by CMP can reduced the recess in polysilicon plugs compared
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1a7eabb546bb6a96add4de6a041c3e91
https://doi.org/10.1109/icvc.1999.820881
https://doi.org/10.1109/icvc.1999.820881