Zobrazeno 1 - 10
of 19
pro vyhledávání: '"Dae Hyun Chung"'
Autor:
Dae-Hyun Chung, Jeong-Hun Won
Publikováno v:
Applied Sciences, Vol 13, Iss 9, p 5500 (2023)
The rotational stiffness of the pocket-type connection used in system scaffolding to join horizontal members and vertical members was evaluated. To investigate the rotational stiffness of connections when subjected to bending moments in the downward,
Externí odkaz:
https://doaj.org/article/096b5c7151c5490180ef1b1108cd7412
Publikováno v:
Journal of Korean Society of Steel Construction. 35:11-19
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3ef158fd0ff02004233512f165fbaeac
https://doi.org/10.7781/kjoss.2023.35.1.011
https://doi.org/10.7781/kjoss.2023.35.1.011
Autor:
Dae-hyun Chung, Byeonggon Ji
Publikováno v:
The Korean Data Analysis Society. 23:183-194
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ac518929a764e92a41e7313949587622
https://doi.org/10.37727/jkdas.2021.23.1.183
https://doi.org/10.37727/jkdas.2021.23.1.183
Autor:
Dae-hyun Chung, Byeonggon Ji
Publikováno v:
The Korean Data Analysis Society. 21:2887-2898
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b027eb5318d194bd84ac54edf1f95d34
https://doi.org/10.37727/jkdas.2019.21.6.2887
https://doi.org/10.37727/jkdas.2019.21.6.2887
Autor:
Dae-hyun Chung, Byeonggon Ji
Publikováno v:
The Korean Data Analysis Society. 19:229-238
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::201cfd1276c676ba019804cbe9ddf3ed
https://doi.org/10.37727/jkdas.2017.19.1.229
https://doi.org/10.37727/jkdas.2017.19.1.229
Publikováno v:
Journal of the Korean Society of Safety. 30:37-43
This study examined the effects of the minimum horizontal load on the structural behaviors and safety of system supports. The minimum horizontal load was frequently ignored in the design of system supports even though the level of that load was spec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ec6bff126ea27b509fd32547284da7b2
https://doi.org/10.14346/jkosos.2015.30.5.37
https://doi.org/10.14346/jkosos.2015.30.5.37
Autor:
Dae-Hyun Chung Dae-Hyun Chung, Seung-Kwon Paek, Ji-Heup Kim Ji-Heup Kim, Byoug-Sup Kwon Byoug-Sup Kwon, Lee-Sup Kim
Publikováno v:
IEEE Transactions on Consumer Electronics. 42:606-616
In a digital VCR, the DCT/IDCT is performed by both the 8/spl times/8 mode and the 2/spl times/4/spl times/8 mode to improve the coding efficiency. A new 2-D DCT/IDCT processor which requires minimal hardware overhead for 8/spl times/8/2/spl times/4/
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cadb94f703a1e624f973ac176bafc5a7
https://doi.org/10.1109/30.536163
https://doi.org/10.1109/30.536163
Autor:
Ki-Woong Yeom, Seung-Jun Bae, Seong-Jin Jang, Hye-Ran Kim, Dae-Hyun Chung, Cheol-Goo Park, Gil-Shin Moon, Hyang-ja Yang, Joo Sun Choi, Jae-Sung Kim, Jae-Young Lee, Min-Sang Park, Kyoung-Ho Kim, Kwang-ll Park, Dae Hyun Kim, Kang-Young Kim, Jingook Kim, Young-Hyun Jun, Yong-Jae Shin, Young-Soo Sohn, Sam-Young Bang, Si-Hong Kim, Jae-Hyung Lee, Kinam Kim, Ho-Kyung Lee, In-Soo Park
Publikováno v:
ISSCC
Demand for high-speed DRAM in graphics application pushes a single-ended I/O signaling to operate up to 6Gb/s. To maintain the speed increase, the GDDR5 specification shifts from GDDR3/4 with respect to forwarded clocking, data training for write and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7f59fae5256fcdac88c998be8845e2e0
https://doi.org/10.1109/isscc.2008.4523165
https://doi.org/10.1109/isscc.2008.4523165
Autor:
null Seung-Kwon Paek, null Ji-Heup Kim, null Byoug-Sup Kwon, null Dae-Hyun Chung, null Lee-Sup Kim
Publikováno v:
International Conference on Consumer Electronics.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5668dc3a2a6132d491744ad8155d0f91
https://doi.org/10.1109/icce.1996.517305
https://doi.org/10.1109/icce.1996.517305
Autor:
Seung-Jun Bae, Young-Soo Sohn, Kwang-ll Park, Kyoung-Ho Kim, Dae-Hyun Chung, Jin-Gook Kim, Si-Hong Kim, Min-Sang Park, Jae-Hyung Lee, Sam-Young Bang, Ho-Kyung Lee, In-Soo Park, Jae-Sung Kim, Dae-Hyun Kim, Hye-Ran Kim, Yong-Jae Shin, Cheol-Goo Park, Gil-Shin Moon, Ki-Woong Yeom, Kang-Young Kim
Publikováno v:
2008 IEEE International Solid-State Circuits Conference - Digest of Technical Papers; 2008, p278-613, 336p