Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Da-Wei Hsu"'
Autor:
Da-Wei Hsu, 徐大為
95
This study numerically investigates the laminar flow for mixed convection heat transfer problem between parallel plates. Constant plate wall temperature and uniform flow entry are assumed. Parameters of Reynolds number, inclined angle, and ar
This study numerically investigates the laminar flow for mixed convection heat transfer problem between parallel plates. Constant plate wall temperature and uniform flow entry are assumed. Parameters of Reynolds number, inclined angle, and ar
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/23675340670826407049
Autor:
Da-Wei Hsu, 許達偉
89
The purpose of the thesis is to explore two main subjects. First of all by interviewing managers and researchers who are highly involved in industrial e-Marketplaces to understand the developing stage of e-Marketplace in Taiwan domestic Steel
The purpose of the thesis is to explore two main subjects. First of all by interviewing managers and researchers who are highly involved in industrial e-Marketplaces to understand the developing stage of e-Marketplace in Taiwan domestic Steel
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/14197271452202777710
Autor:
Da-Wei Hsu
Publikováno v:
China Information. 31:371-390
The tendency of previous research on vulnerability and resilience is to measure these two factors as quantifiable variables that vary between social strata and social groups. Past findings often emphasize structural factors, such as inequality and po
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9f602d0941f2e67f9f87b95d559ecb34
https://doi.org/10.1177/0920203x17737280
https://doi.org/10.1177/0920203x17737280
Publikováno v:
ISVLSI
Effective algorithms have been invented for post-routing redundant via insertion (RVI). However, implementations of these algorithms often ignore some practical issues. In this article, we implement a post-routing RVI algorithm that takes into accoun
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::edf1a153f99416543d39c567f6dd55ba
https://doi.org/10.1109/isvlsi.2009.39
https://doi.org/10.1109/isvlsi.2009.39
Publikováno v:
DDECS
A reticle exposure plan for a multi-project wafer (MPW) defines the sites where reticle images are printed on the wafer. In this paper, we propose an approach to finding a reticle exposure plan that minimizes the wafer fabrication cost rather than th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bec2505f16d81d1fc832ad523dac4666
https://doi.org/10.1109/ddecs.2007.4295308
https://doi.org/10.1109/ddecs.2007.4295308
Autor:
Da-Wei Hsu
Publikováno v:
Conference Papers - American Sociological Association; 2013, p1-27, 27p
Publikováno v:
Proceedings of the 2009 12th International Symposium on Integrated Circuits, ISIC '09; 2009, p17-20, 4p
Publikováno v:
2009 IEEE Computer Society Annual Symposium on VLSI; 2009, p37-42, 6p
Publikováno v:
2007 IEEE Design & Diagnostics of Electronic Circuits & Systems; 2007, p1-4, 4p