Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Da Silva, Sandrine"'
Autor:
Olivier, Ségolène, Decorps, Tifenn, Calvo-Muñoz, Maria-Luisa, Da Silva, Sandrine, Cayron, Cyril, Haumesser, Paul-Henri, Passemard, Gérard
Publikováno v:
In Thin Solid Films 2010 518(17):4773-4778
Autor:
da Silva, Sandrine, Mourier, Thierry, Haumesser, Paul-Henri, Cordeau, M., Haxaire, K., Chainet, Eric, Passemard, Gérard
Publikováno v:
Advanced Metallization Conference 2005
Advanced Metallization Conference 2005, Oct 2005, Colorado Springs, United States. MRS Conference Proceedings, XXI, pp.513-517, 2006
Advanced Metallization Conference 2005, Oct 2005, Colorado Springs, United States. MRS Conference Proceedings, XXI, pp.513-517, 2006
International audience; Copper damascene interconnects technologies have introduced the use of electroplating in semiconductor. Several specific issues were brought by this typical application such as the necessity to plate in very narrow features an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::4db4e1b7b61f2fdd26d3c6c2c37d4d92
https://hal.archives-ouvertes.fr/hal-02384376
https://hal.archives-ouvertes.fr/hal-02384376
Autor:
Canet JL; Ecole Nationale Supérieure de Chimie de Clermont-Ferrand, BP 187, 63174 Aubiere Cedex, France, Laboratoire de Synthèse et Etude de Systèmes à Intérêt Biologique, URA CNRS 485, Université Blaise Pascal, 63177 Aubiere Cedex, France, and Laboratoire de Chimie Structurale Organique, URA CNRS 1384, ICMO, Bât. 410, Université de Paris-Sud, 91405 Orsay Cedex, France., Canet I, Courtieu J, Da Silva S, Gelas J, Troin Y
Publikováno v:
The Journal of organic chemistry [J Org Chem] 1996 Dec 13; Vol. 61 (25), pp. 9035-9037.