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pro vyhledávání: '"Da Jiun Wang"'
Autor:
Tse Chang Li, Chang Hong Shen, Yuan Chou Jing, Gien-Huang Wu, Chang Shuo Chang, Da Jiun Wang, Jen Fin Lin
Publikováno v:
Journal of Materials Engineering and Performance. 28:2292-2304
Four specimen patterns with the microstructure of a microcopper wire are deposited on the Si-wafer substrate plus thermal oxide (SiO2) film as the top layer. Each pattern was prepared to have two kinds of specimens, including with and without ultrath