Zobrazeno 1 - 10
of 17
pro vyhledávání: '"Da Eun Shim"'
Publikováno v:
IEEE Journal on Exploratory Solid-State Computational Devices and Circuits, Vol 10, Pp 13-21 (2024)
While magnetic random-access memories (MRAMs) are promising because of their nonvolatility, relatively fast speeds, and high endurance, there are major challenges in adopting them for the advanced technology nodes. One of the major challenges in scal
Externí odkaz:
https://doaj.org/article/c57ce292b48d402b8edde7ca486724fd
Publikováno v:
IEEE Transactions on Electron Devices. 70:2594-2599
Publikováno v:
ACM Transactions on Design Automation of Electronic Systems.
Publikováno v:
ACM Transactions on Design Automation of Electronic Systems. 26:1-25
Studies have shown that monolithic 3D ( M3D ) ICs outperform the existing through-silicon-via ( TSV ) -based 3D ICs in terms of power, performance, and area ( PPA ) metrics, primarily due to the orders of magnitude denser vertical interconnections of
Autor:
Da Eun Shim, Azad Naeemi
Publikováno v:
2022 IEEE International Interconnect Technology Conference (IITC).
Publikováno v:
2022 Opportunity Research Scholars Symposium (ORSS).
Publikováno v:
IEEE Micro. 39:38-45
In recent years, the size of transistors has been scaled down to a few nanometers and further shrinking will eventually reach the atomic scale. Monolithic three-dimensional (M3D) ICs use the third dimension for placement and routing, which helps redu
Publikováno v:
HPCA
Memory-bound sparse gathering, caused by irregular random memory accesses, has become an obstacle in several on-demand applications such as embedding lookup in recommendation systems. To reduce the amount of data movement, and thereby better utilize
Publikováno v:
2020 IEEE International Interconnect Technology Conference (IITC).
Interconnect scaling has become an ever-growing challenge as the industry advances to ever smaller nodes. In this work we present a comprehensive framework to quantify the impact of interconnect technology parameters on circuit-level performance. Bas
Autor:
Sung Kyu Lim, Da Eun Shim, Christian Krutzik, Anthony Agnesina, John M. Carson, James Yamaguchi, Dan Nakamura
Publikováno v:
ICCD
In this work, we develop a new 3D flash memory cube architecture that integrates multiple flash dies and their logic controller in a unique and optimized fashion for space applications. In our Loaf-of-Bread (LOB) configuration, flash dies are standin