Zobrazeno 1 - 10
of 330
pro vyhledávání: '"Da Bian"'
Autor:
Yon-Jae Kim
Publikováno v:
Journal of the New Korean Philosophical Association. 111:27-52
Publikováno v:
Jin'gangshi yu moliao moju gongcheng, Vol 42, Iss 6, Pp 745-752 (2022)
To improve the polishing efficiency and precision, the optimum processing parameters of Si in the chemical mechanical polishing (CMP) process were analysed by CMP experiments and response surface methodology. The results show that polishing pressure
Externí odkaz:
https://doaj.org/article/13d1af4ab52e402c912a85f4821456f7
Publikováno v:
Jin'gangshi yu moliao moju gongcheng, Vol 42, Iss 6, Pp 753-759 (2022)
To improve the chemical mechanical polishing (CMP) performance of 316L stainless steel, the effect and its mechanism of complexing agent types on the CMP process of 316L stainless steel were studied. The influence of complexing agent types, including
Externí odkaz:
https://doaj.org/article/fa5a041efcc04f05ab7d1405f7e531c5
Publikováno v:
Jin'gangshi yu moliao moju gongcheng, Vol 42, Iss 4, Pp 428-432 (2022)
To obtain homogeneous submicron cerium dioxide (CeO2) polishing powder, CeO2 was synthesized by solvothermal reaction using cerium nitrate (Ce(NO3)3·6H2O) as cerium resource and alcohol-water mixed solution as solvent. The phase composition and morp
Externí odkaz:
https://doaj.org/article/34b5dfabac3e4be99e8c3a1dd982cdf8
Autor:
Iwasaki, Hideo
Publikováno v:
東洋の思想と宗敎. 21:25-43
Autor:
Da, Bian, Yaxuan, Liu, Vasu, Aradhyula Thirumala, Yongxin, Guo, Hao, Tang, Yongwu, Zhao, Yongguang, Wang
Publikováno v:
In Ceramics International 1 June 2021 47(11):15722-15731
Autor:
Da, Bian, Yongxin, Guo, Vasu, Aradhyula Thirumala, Yaxuan, Liu, Yongwu, Zhao, Yongguang, Wang
Publikováno v:
In Ceramics International 1 October 2020 46(14):23027-23034
Publikováno v:
International Journal of Applied Ceramic Technology. 20:1624-1635
Autor:
Da, Bian1,2 (AUTHOR), Jiahong, Li1 (AUTHOR), Yongwu, Zhao1,2 (AUTHOR) 545317516@qq.com, Yongguang, Wang3 (AUTHOR)
Publikováno v:
Surface Engineering. May2022, Vol. 38 Issue 5, p520-528. 9p.