Zobrazeno 1 - 7
of 7
pro vyhledávání: '"DONG-JIN BYUN"'
Publikováno v:
Metals, Vol 11, Iss 2, p 210 (2021)
The nucleation kinetics and morphology of Cu6Sn5 IMCs at the interface between a Sn-0.7Cu-0.2Cr solder and Cu substrate were investigated in this study. A Sn-0.7Cu solder was utilized as a reference to elucidate the impact of Cr addition. The mechani
Externí odkaz:
https://doaj.org/article/285ed120ec714584af2554859ff31872
Autor:
SEONG-EON JIN, DOHAN LEE, SEUNGMOO LEE, JONG-MUN CHOI, BUMJOON KIM, CHANG GYOUN KIM, TACK-MO CHUNG, DONG-JIN BYUN
Publikováno v:
Surface Review and Letters. 17(03):307-310
Cu seed layer was deposited by chemical vapor deposition using new Cu precursor, Cu(dmamb)2. The Cu layers still need the barrier layer to prevent the diffusion, so Ta and Ti were used for the barrier layer on Si(100). Low temperature (LT) copper buf
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______645::f43c8e498c26231d7fa03ec14f372ab6
http://www.worldscinet.com/cgi-bin/details.cgi?type=html&id=pii:S0218625X10013801
http://www.worldscinet.com/cgi-bin/details.cgi?type=html&id=pii:S0218625X10013801
Publikováno v:
ECS Meeting Abstracts. :169-169
not Available.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c40c5ce439be78b359afaec61f81a1d7
https://doi.org/10.1149/ma2007-01/3/169
https://doi.org/10.1149/ma2007-01/3/169